{"quality_controlled":"1","author":[{"first_name":"Claus","last_name":"Scheidemann","id":"38259","full_name":"Scheidemann, Claus"},{"first_name":"Olaf","full_name":"Kirsch, Olaf","last_name":"Kirsch"},{"first_name":"Tobias","full_name":"Hemsel, Tobias","last_name":"Hemsel","id":"210"},{"first_name":"Walter","last_name":"Sextro","id":"21220","full_name":"Sextro, Walter"}],"publisher":"IEEE","abstract":[{"lang":"eng","text":"ue to the constantly growing energy demand of power electronics and the need to reduce the size of electronic components like power modules for e-mobility, new challenges arise for ultrasonic wire bonding: the electrical connection must endure higher thermal and mechanical stress while the connecting partners become more sensitive or require more energy to get bonded. Past investigations have shown already that multi-dimensional ultrasonic bonding and welding yield the same or even better bond quality while reducing the load on the components. This contribution is intended to show whether multidi-mensional thick wire bonding is a promising concept to over-come the new challenges. The focus is on experimental investi-gations of different bond tool trajectories in ultrasonic wire bonding of aluminum and copper wire on DCB's and chips. The bond quality is analyzed by shear tests, microsections and, in the case of aluminum bonding, by a new machine learning method for an objective automated evaluation of the sheared area."}],"status":"public","year":"2022","user_id":"38259","citation":{"bibtex":"@inproceedings{Scheidemann_Kirsch_Hemsel_Sextro_2022, title={Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding}, DOI={<a href=\"https://doi.org/10.1109/estc55720.2022.9939478\">10.1109/estc55720.2022.9939478</a>}, booktitle={2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)}, publisher={IEEE}, author={Scheidemann, Claus and Kirsch, Olaf and Hemsel, Tobias and Sextro, Walter}, year={2022} }","short":"C. Scheidemann, O. Kirsch, T. Hemsel, W. Sextro, in: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), IEEE, 2022.","chicago":"Scheidemann, Claus, Olaf Kirsch, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.” In <i>2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)</i>. IEEE, 2022. <a href=\"https://doi.org/10.1109/estc55720.2022.9939478\">https://doi.org/10.1109/estc55720.2022.9939478</a>.","mla":"Scheidemann, Claus, et al. “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding.” <i>2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)</i>, IEEE, 2022, doi:<a href=\"https://doi.org/10.1109/estc55720.2022.9939478\">10.1109/estc55720.2022.9939478</a>.","ama":"Scheidemann C, Kirsch O, Hemsel T, Sextro W. Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. In: <i>2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)</i>. IEEE; 2022. doi:<a href=\"https://doi.org/10.1109/estc55720.2022.9939478\">10.1109/estc55720.2022.9939478</a>","ieee":"C. Scheidemann, O. Kirsch, T. Hemsel, and W. Sextro, “Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding,” 2022, doi: <a href=\"https://doi.org/10.1109/estc55720.2022.9939478\">10.1109/estc55720.2022.9939478</a>.","apa":"Scheidemann, C., Kirsch, O., Hemsel, T., &#38; Sextro, W. (2022). Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding. <i>2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)</i>. <a href=\"https://doi.org/10.1109/estc55720.2022.9939478\">https://doi.org/10.1109/estc55720.2022.9939478</a>"},"date_created":"2022-11-17T15:17:39Z","_id":"34104","title":"Experimental Investigation of Multidimensional Ultrasonic Heavy Wire Bonding","department":[{"_id":"151"}],"publication_status":"published","language":[{"iso":"eng"}],"type":"conference","date_updated":"2023-09-22T12:24:18Z","publication":"2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)","doi":"10.1109/estc55720.2022.9939478"}