{"date_updated":"2022-12-21T09:31:52Z","publication_status":"published","language":[{"iso":"eng"}],"article_number":"2100446","title":"Atomic Layer Deposition of Copper Metal Films from Cu(acac)            <sub>2</sub>            and Hydroquinone Reductant","department":[{"_id":"302"}],"user_id":"48864","publisher":"Wiley","citation":{"short":"T.S. Tripathi, M. Wilken, C. Hoppe, T. de los Arcos, G. Grundmeier, A. Devi, M. Karppinen, Advanced Engineering Materials 23 (2021).","bibtex":"@article{Tripathi_Wilken_Hoppe_de los Arcos_Grundmeier_Devi_Karppinen_2021, title={Atomic Layer Deposition of Copper Metal Films from Cu(acac)            <sub>2</sub>            and Hydroquinone Reductant}, volume={23}, DOI={<a href=\"https://doi.org/10.1002/adem.202100446\">10.1002/adem.202100446</a>}, number={102100446}, journal={Advanced Engineering Materials}, publisher={Wiley}, author={Tripathi, Tripurari Sharan and Wilken, Martin and Hoppe, Christian and de los Arcos, Teresa and Grundmeier, Guido and Devi, Anjana and Karppinen, Maarit}, year={2021} }","chicago":"Tripathi, Tripurari Sharan, Martin Wilken, Christian Hoppe, Teresa de los Arcos, Guido Grundmeier, Anjana Devi, and Maarit Karppinen. “Atomic Layer Deposition of Copper Metal Films from Cu(Acac)            <sub>2</sub>            and Hydroquinone Reductant.” <i>Advanced Engineering Materials</i> 23, no. 10 (2021). <a href=\"https://doi.org/10.1002/adem.202100446\">https://doi.org/10.1002/adem.202100446</a>.","ama":"Tripathi TS, Wilken M, Hoppe C, et al. Atomic Layer Deposition of Copper Metal Films from Cu(acac)            <sub>2</sub>            and Hydroquinone Reductant. <i>Advanced Engineering Materials</i>. 2021;23(10). doi:<a href=\"https://doi.org/10.1002/adem.202100446\">10.1002/adem.202100446</a>","mla":"Tripathi, Tripurari Sharan, et al. “Atomic Layer Deposition of Copper Metal Films from Cu(Acac)            <sub>2</sub>            and Hydroquinone Reductant.” <i>Advanced Engineering Materials</i>, vol. 23, no. 10, 2100446, Wiley, 2021, doi:<a href=\"https://doi.org/10.1002/adem.202100446\">10.1002/adem.202100446</a>.","ieee":"T. S. Tripathi <i>et al.</i>, “Atomic Layer Deposition of Copper Metal Films from Cu(acac)            <sub>2</sub>            and Hydroquinone Reductant,” <i>Advanced Engineering Materials</i>, vol. 23, no. 10, Art. no. 2100446, 2021, doi: <a href=\"https://doi.org/10.1002/adem.202100446\">10.1002/adem.202100446</a>.","apa":"Tripathi, T. S., Wilken, M., Hoppe, C., de los Arcos, T., Grundmeier, G., Devi, A., &#38; Karppinen, M. (2021). Atomic Layer Deposition of Copper Metal Films from Cu(acac)            <sub>2</sub>            and Hydroquinone Reductant. <i>Advanced Engineering Materials</i>, <i>23</i>(10), Article 2100446. <a href=\"https://doi.org/10.1002/adem.202100446\">https://doi.org/10.1002/adem.202100446</a>"},"author":[{"last_name":"Tripathi","full_name":"Tripathi, Tripurari Sharan","first_name":"Tripurari Sharan"},{"first_name":"Martin","full_name":"Wilken, Martin","last_name":"Wilken"},{"last_name":"Hoppe","full_name":"Hoppe, Christian","id":"27401","first_name":"Christian"},{"full_name":"de los Arcos, Teresa","last_name":"de los Arcos","first_name":"Teresa"},{"id":"194","first_name":"Guido","full_name":"Grundmeier, Guido","last_name":"Grundmeier"},{"full_name":"Devi, Anjana","last_name":"Devi","first_name":"Anjana"},{"full_name":"Karppinen, Maarit","last_name":"Karppinen","first_name":"Maarit"}],"status":"public","year":"2021","_id":"34645","intvolume":"        23","publication_identifier":{"issn":["1438-1656","1527-2648"]},"type":"journal_article","date_created":"2022-12-21T09:30:44Z","publication":"Advanced Engineering Materials","issue":"10","keyword":["Condensed Matter Physics","General Materials Science"],"volume":23,"doi":"10.1002/adem.202100446"}