{"doi":"https://doi.org/10.1016/j.ijadhadh.2023.103392","publication_status":"published","date_created":"2023-01-09T15:48:17Z","quality_controlled":"1","date_updated":"2023-05-09T06:43:41Z","type":"journal_article","publication":"International Journal of Adhesion and Adhesives","article_type":"original","language":[{"iso":"eng"}],"user_id":"32252","citation":{"bibtex":"@article{Kowatz_Teutenberg_Meschut_2023, title={Optimization of inductive fast-curing of epoxy adhesive by model-based kinetics}, volume={124}, DOI={<a href=\"https://doi.org/10.1016/j.ijadhadh.2023.103392\">https://doi.org/10.1016/j.ijadhadh.2023.103392</a>}, journal={International Journal of Adhesion and Adhesives}, publisher={Elsevier}, author={Kowatz, Jannik and Teutenberg, Dominik and Meschut, Gerson}, year={2023} }","short":"J. Kowatz, D. Teutenberg, G. Meschut, International Journal of Adhesion and Adhesives 124 (2023).","chicago":"Kowatz, Jannik, Dominik Teutenberg, and Gerson Meschut. “Optimization of Inductive Fast-Curing of Epoxy Adhesive by Model-Based Kinetics.” <i>International Journal of Adhesion and Adhesives</i> 124 (2023). <a href=\"https://doi.org/10.1016/j.ijadhadh.2023.103392\">https://doi.org/10.1016/j.ijadhadh.2023.103392</a>.","ieee":"J. Kowatz, D. Teutenberg, and G. Meschut, “Optimization of inductive fast-curing of epoxy adhesive by model-based kinetics,” <i>International Journal of Adhesion and Adhesives</i>, vol. 124, 2023, doi: <a href=\"https://doi.org/10.1016/j.ijadhadh.2023.103392\">https://doi.org/10.1016/j.ijadhadh.2023.103392</a>.","ama":"Kowatz J, Teutenberg D, Meschut G. Optimization of inductive fast-curing of epoxy adhesive by model-based kinetics. <i>International Journal of Adhesion and Adhesives</i>. 2023;124. doi:<a href=\"https://doi.org/10.1016/j.ijadhadh.2023.103392\">https://doi.org/10.1016/j.ijadhadh.2023.103392</a>","mla":"Kowatz, Jannik, et al. “Optimization of Inductive Fast-Curing of Epoxy Adhesive by Model-Based Kinetics.” <i>International Journal of Adhesion and Adhesives</i>, vol. 124, Elsevier, 2023, doi:<a href=\"https://doi.org/10.1016/j.ijadhadh.2023.103392\">https://doi.org/10.1016/j.ijadhadh.2023.103392</a>.","apa":"Kowatz, J., Teutenberg, D., &#38; Meschut, G. (2023). Optimization of inductive fast-curing of epoxy adhesive by model-based kinetics. <i>International Journal of Adhesion and Adhesives</i>, <i>124</i>. <a href=\"https://doi.org/10.1016/j.ijadhadh.2023.103392\">https://doi.org/10.1016/j.ijadhadh.2023.103392</a>"},"volume":124,"title":"Optimization of inductive fast-curing of epoxy adhesive by model-based kinetics","_id":"35536","publication_identifier":{"issn":["0143-7496"]},"department":[{"_id":"9"},{"_id":"157"}],"author":[{"orcid":"0000-0002-4972-4718","first_name":"Jannik","full_name":"Kowatz, Jannik","id":"32252","last_name":"Kowatz"},{"first_name":"Dominik","full_name":"Teutenberg, Dominik","last_name":"Teutenberg","id":"537"},{"full_name":"Meschut, Gerson","last_name":"Meschut","id":"32056","orcid":"0000-0002-2763-1246","first_name":"Gerson"}],"publisher":"Elsevier","year":"2023","status":"public","intvolume":"       124"}