{"publisher":"IEEE","date_created":"2023-01-24T10:02:44Z","publication_status":"published","title":"Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings","publication":"2022 Smart Systems Integration (SSI)","user_id":"20179","author":[{"last_name":"Lange","full_name":"Lange, Sven","first_name":"Sven"},{"first_name":"Christian","last_name":"Hedayat","full_name":"Hedayat, Christian"},{"first_name":"Harald","full_name":"Kuhn, Harald","last_name":"Kuhn"},{"first_name":"Ulrich","id":"20179","full_name":"Hilleringmann, Ulrich","last_name":"Hilleringmann"}],"type":"conference","year":"2022","citation":{"bibtex":"@inproceedings{Lange_Hedayat_Kuhn_Hilleringmann_2022, title={Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings}, DOI={<a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">10.1109/ssi56489.2022.9901416</a>}, booktitle={2022 Smart Systems Integration (SSI)}, publisher={IEEE}, author={Lange, Sven and Hedayat, Christian and Kuhn, Harald and Hilleringmann, Ulrich}, year={2022} }","apa":"Lange, S., Hedayat, C., Kuhn, H., &#38; Hilleringmann, U. (2022). Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings. <i>2022 Smart Systems Integration (SSI)</i>. <a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">https://doi.org/10.1109/ssi56489.2022.9901416</a>","chicago":"Lange, Sven, Christian Hedayat, Harald Kuhn, and Ulrich Hilleringmann. “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings.” In <i>2022 Smart Systems Integration (SSI)</i>. IEEE, 2022. <a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">https://doi.org/10.1109/ssi56489.2022.9901416</a>.","ama":"Lange S, Hedayat C, Kuhn H, Hilleringmann U. Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings. In: <i>2022 Smart Systems Integration (SSI)</i>. IEEE; 2022. doi:<a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">10.1109/ssi56489.2022.9901416</a>","ieee":"S. Lange, C. Hedayat, H. Kuhn, and U. Hilleringmann, “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings,” 2022, doi: <a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">10.1109/ssi56489.2022.9901416</a>.","short":"S. Lange, C. Hedayat, H. Kuhn, U. Hilleringmann, in: 2022 Smart Systems Integration (SSI), IEEE, 2022.","mla":"Lange, Sven, et al. “Modeling and Characterization of a 3D Environment for the Design of an Inductively Based Locating Method by Coil Couplings.” <i>2022 Smart Systems Integration (SSI)</i>, IEEE, 2022, doi:<a href=\"https://doi.org/10.1109/ssi56489.2022.9901416\">10.1109/ssi56489.2022.9901416</a>."},"department":[{"_id":"59"}],"status":"public","date_updated":"2023-03-22T10:27:01Z","_id":"39372","doi":"10.1109/ssi56489.2022.9901416","language":[{"iso":"eng"}]}