{"doi":"10.1109/fleps51544.2021.9469764","department":[{"_id":"59"}],"publication_status":"published","status":"public","author":[{"full_name":"Reker, Julia","first_name":"Julia","last_name":"Reker"},{"full_name":"Meyers, Thorsten","first_name":"Thorsten","last_name":"Meyers"},{"last_name":"Vidor","first_name":"Fabio F.","full_name":"Vidor, Fabio F."},{"full_name":"Joubert, Trudi-Heleen","first_name":"Trudi-Heleen","last_name":"Joubert"},{"full_name":"Hilleringmann, Ulrich","last_name":"Hilleringmann","first_name":"Ulrich","id":"20179"}],"title":"Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics","date_updated":"2023-03-23T13:24:52Z","type":"conference","user_id":"20179","year":"2021","_id":"39388","language":[{"iso":"eng"}],"citation":{"bibtex":"@inproceedings{Reker_Meyers_Vidor_Joubert_Hilleringmann_2021, title={Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics}, DOI={<a href=\"https://doi.org/10.1109/fleps51544.2021.9469764\">10.1109/fleps51544.2021.9469764</a>}, booktitle={2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)}, publisher={IEEE}, author={Reker, Julia and Meyers, Thorsten and Vidor, Fabio F. and Joubert, Trudi-Heleen and Hilleringmann, Ulrich}, year={2021} }","apa":"Reker, J., Meyers, T., Vidor, F. F., Joubert, T.-H., &#38; Hilleringmann, U. (2021). Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics. <i>2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)</i>. <a href=\"https://doi.org/10.1109/fleps51544.2021.9469764\">https://doi.org/10.1109/fleps51544.2021.9469764</a>","ama":"Reker J, Meyers T, Vidor FF, Joubert T-H, Hilleringmann U. Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics. In: <i>2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)</i>. IEEE; 2021. doi:<a href=\"https://doi.org/10.1109/fleps51544.2021.9469764\">10.1109/fleps51544.2021.9469764</a>","chicago":"Reker, Julia, Thorsten Meyers, Fabio F. Vidor, Trudi-Heleen Joubert, and Ulrich Hilleringmann. “Integration Process for Self-Aligned Sub-Μm Thin-Film Transistors for Flexible Electronics.” In <i>2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)</i>. IEEE, 2021. <a href=\"https://doi.org/10.1109/fleps51544.2021.9469764\">https://doi.org/10.1109/fleps51544.2021.9469764</a>.","mla":"Reker, Julia, et al. “Integration Process for Self-Aligned Sub-Μm Thin-Film Transistors for Flexible Electronics.” <i>2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)</i>, IEEE, 2021, doi:<a href=\"https://doi.org/10.1109/fleps51544.2021.9469764\">10.1109/fleps51544.2021.9469764</a>.","short":"J. Reker, T. Meyers, F.F. Vidor, T.-H. Joubert, U. Hilleringmann, in: 2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), IEEE, 2021.","ieee":"J. Reker, T. Meyers, F. F. Vidor, T.-H. Joubert, and U. Hilleringmann, “Integration Process for Self-aligned Sub-µm Thin-Film Transistors for Flexible Electronics,” 2021, doi: <a href=\"https://doi.org/10.1109/fleps51544.2021.9469764\">10.1109/fleps51544.2021.9469764</a>."},"date_created":"2023-01-24T10:11:30Z","publisher":"IEEE","publication":"2021 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS)"}