{"year":"2011","_id":"39530","language":[{"iso":"eng"}],"citation":{"ama":"Hilleringmann U, Wolff K, Assion F, Vidor FF, Wirth GI. Semiconductor nanoparticles for electronic device integration on foils. In: <i>IEEE Africon ’11</i>. IEEE; 2011. doi:<a href=\"https://doi.org/10.1109/afrcon.2011.6071983\">10.1109/afrcon.2011.6071983</a>","apa":"Hilleringmann, U., Wolff, K., Assion, F., Vidor, F. F., &#38; Wirth, G. I. (2011). Semiconductor nanoparticles for electronic device integration on foils. <i>IEEE Africon ’11</i>. <a href=\"https://doi.org/10.1109/afrcon.2011.6071983\">https://doi.org/10.1109/afrcon.2011.6071983</a>","ieee":"U. Hilleringmann, K. Wolff, F. Assion, F. F. Vidor, and G. I. Wirth, “Semiconductor nanoparticles for electronic device integration on foils,” 2011, doi: <a href=\"https://doi.org/10.1109/afrcon.2011.6071983\">10.1109/afrcon.2011.6071983</a>.","short":"U. Hilleringmann, K. Wolff, F. Assion, F.F. Vidor, G.I. Wirth, in: IEEE Africon ’11, IEEE, 2011.","bibtex":"@inproceedings{Hilleringmann_Wolff_Assion_Vidor_Wirth_2011, title={Semiconductor nanoparticles for electronic device integration on foils}, DOI={<a href=\"https://doi.org/10.1109/afrcon.2011.6071983\">10.1109/afrcon.2011.6071983</a>}, booktitle={IEEE Africon ’11}, publisher={IEEE}, author={Hilleringmann, Ulrich and Wolff, K. and Assion, F. and Vidor, F. F. and Wirth, G. I.}, year={2011} }","chicago":"Hilleringmann, Ulrich, K. Wolff, F. Assion, F. F. Vidor, and G. I. Wirth. “Semiconductor Nanoparticles for Electronic Device Integration on Foils.” In <i>IEEE Africon ’11</i>. IEEE, 2011. <a href=\"https://doi.org/10.1109/afrcon.2011.6071983\">https://doi.org/10.1109/afrcon.2011.6071983</a>.","mla":"Hilleringmann, Ulrich, et al. “Semiconductor Nanoparticles for Electronic Device Integration on Foils.” <i>IEEE Africon ’11</i>, IEEE, 2011, doi:<a href=\"https://doi.org/10.1109/afrcon.2011.6071983\">10.1109/afrcon.2011.6071983</a>."},"date_created":"2023-01-24T11:58:40Z","publisher":"IEEE","publication":"IEEE Africon '11","author":[{"id":"20179","first_name":"Ulrich","last_name":"Hilleringmann","full_name":"Hilleringmann, Ulrich"},{"first_name":"K.","last_name":"Wolff","full_name":"Wolff, K."},{"first_name":"F.","last_name":"Assion","full_name":"Assion, F."},{"full_name":"Vidor, F. F.","first_name":"F. F.","last_name":"Vidor"},{"full_name":"Wirth, G. I.","last_name":"Wirth","first_name":"G. I."}],"status":"public","date_updated":"2023-03-21T10:20:55Z","title":"Semiconductor nanoparticles for electronic device integration on foils","type":"conference","user_id":"20179","publication_status":"published","doi":"10.1109/afrcon.2011.6071983","department":[{"_id":"59"}]}