book chapter Metallic and semiconducting nanoparticles in LCs published Anshul Sharma author Martin Urbanski author Taizo Mori author Heinz-Siegfried Kitzerow author 254 Torsten Hegmann author 313 department 230 department 638 department WORLD SCIENTIFIC2016 eng Series in Soft Condensed Matter 1793-147910.1142/9789814619264_0014 Sharma, Anshul, Martin Urbanski, Taizo Mori, Heinz-Siegfried Kitzerow, and Torsten Hegmann. “Metallic and Semiconducting Nanoparticles in LCs.” In <i>Series in Soft Condensed Matter</i>. WORLD SCIENTIFIC, 2016. <a href="https://doi.org/10.1142/9789814619264_0014">https://doi.org/10.1142/9789814619264_0014</a>. A. Sharma, M. Urbanski, T. Mori, H.-S. Kitzerow, and T. Hegmann, “Metallic and semiconducting nanoparticles in LCs,” in <i>Series in Soft Condensed Matter</i>, WORLD SCIENTIFIC, 2016. Sharma A, Urbanski M, Mori T, Kitzerow H-S, Hegmann T. Metallic and semiconducting nanoparticles in LCs. In: <i>Series in Soft Condensed Matter</i>. WORLD SCIENTIFIC; 2016. doi:<a href="https://doi.org/10.1142/9789814619264_0014">10.1142/9789814619264_0014</a> A. Sharma, M. Urbanski, T. Mori, H.-S. Kitzerow, T. Hegmann, in: Series in Soft Condensed Matter, WORLD SCIENTIFIC, 2016. Sharma, Anshul, et al. “Metallic and Semiconducting Nanoparticles in LCs.” <i>Series in Soft Condensed Matter</i>, WORLD SCIENTIFIC, 2016, doi:<a href="https://doi.org/10.1142/9789814619264_0014">10.1142/9789814619264_0014</a>. @inbook{Sharma_Urbanski_Mori_Kitzerow_Hegmann_2016, title={Metallic and semiconducting nanoparticles in LCs}, DOI={<a href="https://doi.org/10.1142/9789814619264_0014">10.1142/9789814619264_0014</a>}, booktitle={Series in Soft Condensed Matter}, publisher={WORLD SCIENTIFIC}, author={Sharma, Anshul and Urbanski, Martin and Mori, Taizo and Kitzerow, Heinz-Siegfried and Hegmann, Torsten}, year={2016} } Sharma, A., Urbanski, M., Mori, T., Kitzerow, H.-S., &#38; Hegmann, T. (2016). Metallic and semiconducting nanoparticles in LCs. In <i>Series in Soft Condensed Matter</i>. WORLD SCIENTIFIC. <a href="https://doi.org/10.1142/9789814619264_0014">https://doi.org/10.1142/9789814619264_0014</a> 396702023-01-24T17:46:12Z2023-01-24T17:46:56Z