{"publication":"IECON'99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029)","_id":"39887","citation":{"chicago":"Hilleringmann, Ulrich, T. Vieregge, and J.T. Horstmann. “Masking and Etching of Silicon and Related Materials for Geometries down to 25 Nm.” In IECON’99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029). IEEE, 2003. https://doi.org/10.1109/iecon.1999.822171.","ieee":"U. Hilleringmann, T. Vieregge, and J. T. Horstmann, “Masking and etching of silicon and related materials for geometries down to 25 nm,” 2003, doi: 10.1109/iecon.1999.822171.","apa":"Hilleringmann, U., Vieregge, T., & Horstmann, J. T. (2003). Masking and etching of silicon and related materials for geometries down to 25 nm. IECON’99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029). https://doi.org/10.1109/iecon.1999.822171","bibtex":"@inproceedings{Hilleringmann_Vieregge_Horstmann_2003, title={Masking and etching of silicon and related materials for geometries down to 25 nm}, DOI={10.1109/iecon.1999.822171}, booktitle={IECON’99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029)}, publisher={IEEE}, author={Hilleringmann, Ulrich and Vieregge, T. and Horstmann, J.T.}, year={2003} }","ama":"Hilleringmann U, Vieregge T, Horstmann JT. Masking and etching of silicon and related materials for geometries down to 25 nm. In: IECON’99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029). IEEE; 2003. doi:10.1109/iecon.1999.822171","short":"U. Hilleringmann, T. Vieregge, J.T. Horstmann, in: IECON’99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029), IEEE, 2003.","mla":"Hilleringmann, Ulrich, et al. “Masking and Etching of Silicon and Related Materials for Geometries down to 25 Nm.” IECON’99. Conference Proceedings. 25th Annual Conference of the IEEE Industrial Electronics Society (Cat. No.99CH37029), IEEE, 2003, doi:10.1109/iecon.1999.822171."},"date_created":"2023-01-25T09:12:16Z","status":"public","doi":"10.1109/iecon.1999.822171","date_updated":"2023-03-21T09:59:07Z","year":"2003","title":"Masking and etching of silicon and related materials for geometries down to 25 nm","user_id":"20179","language":[{"iso":"eng"}],"publisher":"IEEE","department":[{"_id":"59"}],"type":"conference","author":[{"first_name":"Ulrich","id":"20179","full_name":"Hilleringmann, Ulrich","last_name":"Hilleringmann"},{"first_name":"T.","last_name":"Vieregge","full_name":"Vieregge, T."},{"last_name":"Horstmann","full_name":"Horstmann, J.T.","first_name":"J.T."}],"publication_status":"published"}