[{"year":"2023","citation":{"short":"N. Chudalla, G. Meschut, D. Teutenberg, M. Schneider, D. Smart,  Adhäsion KLEBEN &#38; DICHTEN (2023).","bibtex":"@article{Chudalla_Meschut_Teutenberg_Schneider_Smart_2023, title={Rechnergestützte Versagensanalyse geklebter Verbindungen}, DOI={<a href=\"https://doi.org/10.1007/s35145-023-1198-x \">https://doi.org/10.1007/s35145-023-1198-x </a>}, number={6}, journal={ adhäsion KLEBEN &#38; DICHTEN}, author={Chudalla, Nick and Meschut, Gerson and Teutenberg, Dominik and Schneider, Miriam and Smart, Dominic }, year={2023} }","mla":"Chudalla, Nick, et al. “Rechnergestützte Versagensanalyse Geklebter Verbindungen.” <i> Adhäsion KLEBEN &#38; DICHTEN</i>, no. 6, 2023, doi:<a href=\"https://doi.org/10.1007/s35145-023-1198-x \">https://doi.org/10.1007/s35145-023-1198-x </a>.","apa":"Chudalla, N., Meschut, G., Teutenberg, D., Schneider, M., &#38; Smart, D. (2023). Rechnergestützte Versagensanalyse geklebter Verbindungen. <i> Adhäsion KLEBEN &#38; DICHTEN</i>, <i>6</i>. <a href=\"https://doi.org/10.1007/s35145-023-1198-x \">https://doi.org/10.1007/s35145-023-1198-x </a>","ama":"Chudalla N, Meschut G, Teutenberg D, Schneider M, Smart D. Rechnergestützte Versagensanalyse geklebter Verbindungen. <i> adhäsion KLEBEN &#38; DICHTEN</i>. 2023;(6). doi:<a href=\"https://doi.org/10.1007/s35145-023-1198-x \">https://doi.org/10.1007/s35145-023-1198-x </a>","ieee":"N. Chudalla, G. Meschut, D. Teutenberg, M. Schneider, and D. Smart, “Rechnergestützte Versagensanalyse geklebter Verbindungen,” <i> adhäsion KLEBEN &#38; DICHTEN</i>, no. 6, 2023, doi: <a href=\"https://doi.org/10.1007/s35145-023-1198-x \">https://doi.org/10.1007/s35145-023-1198-x </a>.","chicago":"Chudalla, Nick, Gerson Meschut, Dominik Teutenberg, Miriam Schneider, and Dominic  Smart. “Rechnergestützte Versagensanalyse Geklebter Verbindungen.” <i> Adhäsion KLEBEN &#38; DICHTEN</i>, no. 6 (2023). <a href=\"https://doi.org/10.1007/s35145-023-1198-x \">https://doi.org/10.1007/s35145-023-1198-x </a>."},"quality_controlled":"1","issue":"6","title":"Rechnergestützte Versagensanalyse geklebter Verbindungen","doi":"https://doi.org/10.1007/s35145-023-1198-x ","date_updated":"2026-02-23T08:27:14Z","date_created":"2023-07-27T06:55:20Z","author":[{"first_name":"Nick","id":"41235","full_name":"Chudalla, Nick","last_name":"Chudalla"},{"last_name":"Meschut","orcid":"0000-0002-2763-1246","id":"32056","full_name":"Meschut, Gerson","first_name":"Gerson"},{"first_name":"Dominik","full_name":"Teutenberg, Dominik","id":"537","last_name":"Teutenberg"},{"last_name":"Schneider","full_name":"Schneider, Miriam","first_name":"Miriam"},{"first_name":"Dominic ","full_name":"Smart, Dominic ","last_name":"Smart"}],"status":"public","type":"journal_article","publication":" adhäsion KLEBEN & DICHTEN","language":[{"iso":"eng"}],"_id":"46164","user_id":"537","department":[{"_id":"157"}]}]