{"_id":"46164","language":[{"iso":"eng"}],"user_id":"537","doi":"https://doi.org/10.1007/s35145-023-1198-x ","year":"2023","title":"Rechnergestützte Versagensanalyse geklebter Verbindungen","status":"public","author":[{"id":"41235","full_name":"Chudalla, Nick","last_name":"Chudalla","first_name":"Nick"},{"full_name":"Meschut, Gerson","last_name":"Meschut","orcid":"0000-0002-2763-1246","first_name":"Gerson","id":"32056"},{"id":"537","first_name":"Dominik","last_name":"Teutenberg","full_name":"Teutenberg, Dominik"},{"full_name":"Schneider, Miriam","first_name":"Miriam","last_name":"Schneider"},{"full_name":"Smart, Dominic ","last_name":"Smart","first_name":"Dominic "}],"date_updated":"2026-02-23T08:27:14Z","date_created":"2023-07-27T06:55:20Z","type":"journal_article","department":[{"_id":"157"}],"publication":" adhäsion KLEBEN & DICHTEN","issue":"6","citation":{"ama":"Chudalla N, Meschut G, Teutenberg D, Schneider M, Smart D. Rechnergestützte Versagensanalyse geklebter Verbindungen. <i> adhäsion KLEBEN &#38; DICHTEN</i>. 2023;(6). doi:<a href=\"https://doi.org/10.1007/s35145-023-1198-x \">https://doi.org/10.1007/s35145-023-1198-x </a>","bibtex":"@article{Chudalla_Meschut_Teutenberg_Schneider_Smart_2023, title={Rechnergestützte Versagensanalyse geklebter Verbindungen}, DOI={<a href=\"https://doi.org/10.1007/s35145-023-1198-x \">https://doi.org/10.1007/s35145-023-1198-x </a>}, number={6}, journal={ adhäsion KLEBEN &#38; DICHTEN}, author={Chudalla, Nick and Meschut, Gerson and Teutenberg, Dominik and Schneider, Miriam and Smart, Dominic }, year={2023} }","mla":"Chudalla, Nick, et al. “Rechnergestützte Versagensanalyse Geklebter Verbindungen.” <i> Adhäsion KLEBEN &#38; DICHTEN</i>, no. 6, 2023, doi:<a href=\"https://doi.org/10.1007/s35145-023-1198-x \">https://doi.org/10.1007/s35145-023-1198-x </a>.","short":"N. Chudalla, G. Meschut, D. Teutenberg, M. Schneider, D. Smart,  Adhäsion KLEBEN &#38; DICHTEN (2023).","chicago":"Chudalla, Nick, Gerson Meschut, Dominik Teutenberg, Miriam Schneider, and Dominic  Smart. “Rechnergestützte Versagensanalyse Geklebter Verbindungen.” <i> Adhäsion KLEBEN &#38; DICHTEN</i>, no. 6 (2023). <a href=\"https://doi.org/10.1007/s35145-023-1198-x \">https://doi.org/10.1007/s35145-023-1198-x </a>.","apa":"Chudalla, N., Meschut, G., Teutenberg, D., Schneider, M., &#38; Smart, D. (2023). Rechnergestützte Versagensanalyse geklebter Verbindungen. <i> Adhäsion KLEBEN &#38; DICHTEN</i>, <i>6</i>. <a href=\"https://doi.org/10.1007/s35145-023-1198-x \">https://doi.org/10.1007/s35145-023-1198-x </a>","ieee":"N. Chudalla, G. Meschut, D. Teutenberg, M. Schneider, and D. Smart, “Rechnergestützte Versagensanalyse geklebter Verbindungen,” <i> adhäsion KLEBEN &#38; DICHTEN</i>, no. 6, 2023, doi: <a href=\"https://doi.org/10.1007/s35145-023-1198-x \">https://doi.org/10.1007/s35145-023-1198-x </a>."},"quality_controlled":"1"}