{"_id":"48571","status":"public","date_created":"2023-10-31T14:00:13Z","doi":"10.1109/indin51400.2023.10217972","publication_status":"published","author":[{"first_name":"Steven","full_name":"Koppert, Steven","last_name":"Koppert"},{"first_name":"Maximilian","id":"52175","last_name":"Bause","full_name":"Bause, Maximilian"},{"full_name":"Henke, Christian","last_name":"Henke","first_name":"Christian"},{"first_name":"Ansgar","id":"552","full_name":"Trächtler, Ansgar","last_name":"Trächtler"}],"year":"2023","user_id":"41470","citation":{"short":"S. Koppert, M. Bause, C. Henke, A. Trächtler, in: 2023 IEEE 21st International Conference on Industrial Informatics (INDIN), IEEE, 2023.","mla":"Koppert, Steven, et al. “Learning the Automated Setup of Profile Wrapping Lines for New Products from Few Past Setups.” <i>2023 IEEE 21st International Conference on Industrial Informatics (INDIN)</i>, IEEE, 2023, doi:<a href=\"https://doi.org/10.1109/indin51400.2023.10217972\">10.1109/indin51400.2023.10217972</a>.","chicago":"Koppert, Steven, Maximilian Bause, Christian Henke, and Ansgar Trächtler. “Learning the Automated Setup of Profile Wrapping Lines for New Products from Few Past Setups.” In <i>2023 IEEE 21st International Conference on Industrial Informatics (INDIN)</i>. IEEE, 2023. <a href=\"https://doi.org/10.1109/indin51400.2023.10217972\">https://doi.org/10.1109/indin51400.2023.10217972</a>.","bibtex":"@inproceedings{Koppert_Bause_Henke_Trächtler_2023, title={Learning the Automated Setup of Profile Wrapping Lines for New Products from Few Past Setups}, DOI={<a href=\"https://doi.org/10.1109/indin51400.2023.10217972\">10.1109/indin51400.2023.10217972</a>}, booktitle={2023 IEEE 21st International Conference on Industrial Informatics (INDIN)}, publisher={IEEE}, author={Koppert, Steven and Bause, Maximilian and Henke, Christian and Trächtler, Ansgar}, year={2023} }","ieee":"S. Koppert, M. Bause, C. Henke, and A. Trächtler, “Learning the Automated Setup of Profile Wrapping Lines for New Products from Few Past Setups,” 2023, doi: <a href=\"https://doi.org/10.1109/indin51400.2023.10217972\">10.1109/indin51400.2023.10217972</a>.","apa":"Koppert, S., Bause, M., Henke, C., &#38; Trächtler, A. (2023). Learning the Automated Setup of Profile Wrapping Lines for New Products from Few Past Setups. <i>2023 IEEE 21st International Conference on Industrial Informatics (INDIN)</i>. <a href=\"https://doi.org/10.1109/indin51400.2023.10217972\">https://doi.org/10.1109/indin51400.2023.10217972</a>","ama":"Koppert S, Bause M, Henke C, Trächtler A. Learning the Automated Setup of Profile Wrapping Lines for New Products from Few Past Setups. In: <i>2023 IEEE 21st International Conference on Industrial Informatics (INDIN)</i>. IEEE; 2023. doi:<a href=\"https://doi.org/10.1109/indin51400.2023.10217972\">10.1109/indin51400.2023.10217972</a>"},"publisher":"IEEE","type":"conference","department":[{"_id":"153"},{"_id":"241"}],"quality_controlled":"1","language":[{"iso":"eng"}],"date_updated":"2023-10-31T14:32:16Z","title":"Learning the Automated Setup of Profile Wrapping Lines for New Products from Few Past Setups","publication":"2023 IEEE 21st International Conference on Industrial Informatics (INDIN)"}