{"department":[{"_id":"563"}],"type":"conference","citation":{"bibtex":"@inproceedings{Seidenberg_Disselkamp_Jürgenhake_Wicker_Dumitrescu_Tolo_2023, title={TCO analysis of a modular and integral product architecture in shipbuilding}, DOI={<a href=\"https://doi.org/ 10.1109/ICE/ITMC58018.2023.10332277\"> 10.1109/ICE/ITMC58018.2023.10332277</a>}, author={Seidenberg, Tobias and Disselkamp, Jan-Philipp and Jürgenhake, Christoph and Wicker, Ansgar and Dumitrescu, Roman and Tolo, Edmund}, year={2023} }","ieee":"T. Seidenberg, J.-P. Disselkamp, C. Jürgenhake, A. Wicker, R. Dumitrescu, and E. Tolo, “TCO analysis of a modular and integral product architecture in shipbuilding,” presented at the IEEE Ice Conference 2023, Edingburgh, 2023, doi: <a href=\"https://doi.org/ 10.1109/ICE/ITMC58018.2023.10332277\"> 10.1109/ICE/ITMC58018.2023.10332277</a>.","ama":"Seidenberg T, Disselkamp J-P, Jürgenhake C, Wicker A, Dumitrescu R, Tolo E. TCO analysis of a modular and integral product architecture in shipbuilding. In: ; 2023. doi:<a href=\"https://doi.org/ 10.1109/ICE/ITMC58018.2023.10332277\"> 10.1109/ICE/ITMC58018.2023.10332277</a>","short":"T. Seidenberg, J.-P. Disselkamp, C. Jürgenhake, A. Wicker, R. Dumitrescu, E. Tolo, in: 2023.","apa":"Seidenberg, T., Disselkamp, J.-P., Jürgenhake, C., Wicker, A., Dumitrescu, R., &#38; Tolo, E. (2023). <i>TCO analysis of a modular and integral product architecture in shipbuilding</i>. IEEE Ice Conference 2023, Edingburgh. <a href=\"https://doi.org/ 10.1109/ICE/ITMC58018.2023.10332277\">https://doi.org/ 10.1109/ICE/ITMC58018.2023.10332277</a>","mla":"Seidenberg, Tobias, et al. <i>TCO Analysis of a Modular and Integral Product Architecture in Shipbuilding</i>. 2023, doi:<a href=\"https://doi.org/ 10.1109/ICE/ITMC58018.2023.10332277\"> 10.1109/ICE/ITMC58018.2023.10332277</a>.","chicago":"Seidenberg, Tobias, Jan-Philipp Disselkamp, Christoph Jürgenhake, Ansgar Wicker, Roman Dumitrescu, and Edmund Tolo. “TCO Analysis of a Modular and Integral Product Architecture in Shipbuilding,” 2023. <a href=\"https://doi.org/ 10.1109/ICE/ITMC58018.2023.10332277\">https://doi.org/ 10.1109/ICE/ITMC58018.2023.10332277</a>."},"user_id":"15782","year":"2023","author":[{"last_name":"Seidenberg","full_name":"Seidenberg, Tobias","first_name":"Tobias"},{"last_name":"Disselkamp","full_name":"Disselkamp, Jan-Philipp","first_name":"Jan-Philipp"},{"last_name":"Jürgenhake","full_name":"Jürgenhake, Christoph","first_name":"Christoph"},{"first_name":"Ansgar","last_name":"Wicker","full_name":"Wicker, Ansgar"},{"first_name":"Roman","id":"16190","last_name":"Dumitrescu","full_name":"Dumitrescu, Roman"},{"first_name":"Edmund","last_name":"Tolo","full_name":"Tolo, Edmund"}],"date_created":"2023-11-30T10:27:50Z","doi":" 10.1109/ICE/ITMC58018.2023.10332277","status":"public","_id":"49361","conference":{"end_date":"2023-06-22","name":"IEEE Ice Conference 2023","location":"Edingburgh","start_date":"2023-06-19"},"title":"TCO analysis of a modular and integral product architecture in shipbuilding","date_updated":"2023-12-06T07:46:08Z","language":[{"iso":"eng"}]}