{"conference":{"name":"International Conference on Functional Materials & Devices 2023 (ICFMD 2023)","location":"Jeju, Korea","start_date":"2023-10-31","end_date":"2023-11-03"},"_id":"51119","user_id":"38259","date_created":"2024-02-01T16:03:41Z","author":[{"first_name":"Claus","id":"38259","full_name":"Scheidemann, Claus","last_name":"Scheidemann"},{"first_name":"Oliver Ernst Caspar","id":"53321","last_name":"Hagedorn","full_name":"Hagedorn, Oliver Ernst Caspar"},{"first_name":"Tobias","id":"210","full_name":"Hemsel, Tobias","last_name":"Hemsel"},{"full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter","id":"21220"}],"department":[{"_id":"151"}],"title":"Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process","type":"conference_abstract","citation":{"bibtex":"@inproceedings{Scheidemann_Hagedorn_Hemsel_Sextro_2023, title={Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process}, author={Scheidemann, Claus and Hagedorn, Oliver Ernst Caspar and Hemsel, Tobias and Sextro, Walter}, year={2023} }","ieee":"C. Scheidemann, O. E. C. Hagedorn, T. Hemsel, and W. Sextro, “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” presented at the International Conference on Functional Materials &#38; Devices 2023 (ICFMD 2023), Jeju, Korea, 2023.","chicago":"Scheidemann, Claus, Oliver Ernst Caspar Hagedorn, Tobias Hemsel, and Walter Sextro. “Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process,” 2023.","short":"C. Scheidemann, O.E.C. Hagedorn, T. Hemsel, W. Sextro, in: 2023.","mla":"Scheidemann, Claus, et al. <i>Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process</i>. 2023.","ama":"Scheidemann C, Hagedorn OEC, Hemsel T, Sextro W. Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process. In: ; 2023.","apa":"Scheidemann, C., Hagedorn, O. E. C., Hemsel, T., &#38; Sextro, W. (2023). <i>Experimental Investigation of Bond Formation and Wire Deformation in the Ultrasonic Wire Bonding Process</i>. International Conference on Functional Materials &#38; Devices 2023 (ICFMD 2023), Jeju, Korea."},"year":"2023","date_updated":"2024-02-01T16:04:33Z","status":"public","language":[{"iso":"eng"}]}