{"date_created":"2024-03-20T14:00:11Z","_id":"52689","status":"public","corporate_editor":["DVS Media GmbH"],"author":[{"full_name":"Striewe, Marius","last_name":"Striewe","first_name":"Marius","id":"30228"},{"first_name":"Dominik","id":"537","full_name":"Teutenberg, Dominik","last_name":"Teutenberg"},{"last_name":"Hein","full_name":"Hein, David","id":"7728","first_name":"David"},{"orcid":"0000-0002-2763-1246","id":"32056","first_name":"Gerson","last_name":"Meschut","full_name":"Meschut, Gerson"},{"first_name":"Lars","last_name":"Schmelzle","full_name":"Schmelzle, Lars"},{"full_name":"Mergheim, Julia","last_name":"Mergheim","first_name":"Julia"},{"last_name":"Possart","full_name":"Possart, Gunnar","first_name":"Gunnar"}],"year":"2023","user_id":"30228","publication_identifier":{"isbn":["978-3-96144-139-6"]},"volume":369,"type":"book_chapter","citation":{"ama":"Striewe M, Teutenberg D, Hein D, et al. Methode zur Simulation des temperaturabhängigen Crashverhaltens von strukturellen Klebverbindungen. In: DVS Media GmbH, ed. <i>Klebtechnische Doktorandenseminare 2020 - 2022</i>. Vol 369. DVS Berichte. ; 2023.","ieee":"M. Striewe <i>et al.</i>, “Methode zur Simulation des temperaturabhängigen Crashverhaltens von strukturellen Klebverbindungen,” in <i>Klebtechnische Doktorandenseminare 2020 - 2022</i>, vol. 369, DVS Media GmbH, Ed. 2023.","bibtex":"@inbook{Striewe_Teutenberg_Hein_Meschut_Schmelzle_Mergheim_Possart_2023, series={DVS Berichte}, title={Methode zur Simulation des temperaturabhängigen Crashverhaltens von strukturellen Klebverbindungen}, volume={369}, booktitle={Klebtechnische Doktorandenseminare 2020 - 2022}, author={Striewe, Marius and Teutenberg, Dominik and Hein, David and Meschut, Gerson and Schmelzle, Lars and Mergheim, Julia and Possart, Gunnar}, editor={DVS Media GmbH}, year={2023}, collection={DVS Berichte} }","short":"M. Striewe, D. Teutenberg, D. Hein, G. Meschut, L. Schmelzle, J. Mergheim, G. Possart, in: DVS Media GmbH (Ed.), Klebtechnische Doktorandenseminare 2020 - 2022, 2023.","apa":"Striewe, M., Teutenberg, D., Hein, D., Meschut, G., Schmelzle, L., Mergheim, J., &#38; Possart, G. (2023). Methode zur Simulation des temperaturabhängigen Crashverhaltens von strukturellen Klebverbindungen. In DVS Media GmbH (Ed.), <i>Klebtechnische Doktorandenseminare 2020 - 2022</i> (Vol. 369).","chicago":"Striewe, Marius, Dominik Teutenberg, David Hein, Gerson Meschut, Lars Schmelzle, Julia Mergheim, and Gunnar Possart. “Methode zur Simulation des temperaturabhängigen Crashverhaltens von strukturellen Klebverbindungen.” In <i>Klebtechnische Doktorandenseminare 2020 - 2022</i>, edited by DVS Media GmbH, Vol. 369. DVS Berichte, 2023.","mla":"Striewe, Marius, et al. “Methode zur Simulation des temperaturabhängigen Crashverhaltens von strukturellen Klebverbindungen.” <i>Klebtechnische Doktorandenseminare 2020 - 2022</i>, edited by DVS Media GmbH, vol. 369, 2023."},"department":[{"_id":"157"}],"intvolume":"       369","language":[{"iso":"ger"}],"series_title":"DVS Berichte","date_updated":"2024-03-20T14:00:50Z","title":"Methode zur Simulation des temperaturabhängigen Crashverhaltens von strukturellen Klebverbindungen","conference":{"name":"13. Doktorandenseminar Klebtechnik","location":"Blankenburg (Harz)"},"publication":"Klebtechnische Doktorandenseminare 2020 - 2022"}