{"author":[{"full_name":"Beule, Felix","first_name":"Felix","last_name":"Beule","id":"66192"},{"id":"65415","full_name":"Al Trjman, Mohamad","first_name":"Mohamad","last_name":"Al Trjman"},{"full_name":"Teutenberg, Dominik","last_name":"Teutenberg","first_name":"Dominik","id":"537"},{"full_name":"Meschut, Gerson","first_name":"Gerson","orcid":"0000-0002-2763-1246","last_name":"Meschut","id":"32056"}],"conference":{"location":"Shanghai","name":"International Symposium Smart Joining Solutions for Future Mobility","start_date":"2024-04-24","end_date":"2024-04-24"},"title":"Method development (modelling, simulation, characterisation) in adhesive bonding technology","status":"public","year":"2024","date_updated":"2024-05-10T06:07:02Z","language":[{"iso":"eng"}],"_id":"54142","user_id":"66192","citation":{"chicago":"Beule, Felix, Mohamad Al Trjman, Dominik Teutenberg, and Gerson Meschut. “Method Development (Modelling, Simulation, Characterisation) in Adhesive Bonding Technology.” Shanghai, 2024.","short":"F. Beule, M. Al Trjman, D. Teutenberg, G. Meschut, in: Shanghai, 2024.","ieee":"F. Beule, M. Al Trjman, D. Teutenberg, and G. Meschut, “Method development (modelling, simulation, characterisation) in adhesive bonding technology,” presented at the International Symposium Smart Joining Solutions for Future Mobility, Shanghai, 2024.","apa":"Beule, F., Al Trjman, M., Teutenberg, D., &#38; Meschut, G. (2024). <i>Method development (modelling, simulation, characterisation) in adhesive bonding technology</i>. International Symposium Smart Joining Solutions for Future Mobility, Shanghai.","bibtex":"@inproceedings{Beule_Al Trjman_Teutenberg_Meschut_2024, place={Shanghai}, title={Method development (modelling, simulation, characterisation) in adhesive bonding technology}, author={Beule, Felix and Al Trjman, Mohamad and Teutenberg, Dominik and Meschut, Gerson}, year={2024} }","ama":"Beule F, Al Trjman M, Teutenberg D, Meschut G. Method development (modelling, simulation, characterisation) in adhesive bonding technology. In: ; 2024.","mla":"Beule, Felix, et al. <i>Method Development (Modelling, Simulation, Characterisation) in Adhesive Bonding Technology</i>. 2024."},"date_created":"2024-05-10T06:06:50Z","place":"Shanghai","department":[{"_id":"157"}],"type":"conference_abstract"}