{"department":[{"_id":"157"}],"status":"public","author":[{"first_name":"Felix","id":"66192","full_name":"Beule, Felix","last_name":"Beule"},{"id":"65415","first_name":"Mohamad","last_name":"Al Trjman","full_name":"Al Trjman, Mohamad"},{"full_name":"Teutenberg, Dominik","last_name":"Teutenberg","id":"537","first_name":"Dominik"},{"last_name":"Meschut","full_name":"Meschut, Gerson","orcid":"0000-0002-2763-1246","first_name":"Gerson","id":"32056"}],"language":[{"iso":"eng"}],"place":"Shanghai","date_updated":"2024-05-10T06:07:02Z","date_created":"2024-05-10T06:06:50Z","type":"conference_abstract","conference":{"start_date":"2024-04-24","end_date":"2024-04-24","location":"Shanghai","name":"International Symposium Smart Joining Solutions for Future Mobility"},"_id":"54142","title":"Method development (modelling, simulation, characterisation) in adhesive bonding technology","citation":{"ama":"Beule F, Al Trjman M, Teutenberg D, Meschut G. Method development (modelling, simulation, characterisation) in adhesive bonding technology. In: ; 2024.","chicago":"Beule, Felix, Mohamad Al Trjman, Dominik Teutenberg, and Gerson Meschut. “Method Development (Modelling, Simulation, Characterisation) in Adhesive Bonding Technology.” Shanghai, 2024.","apa":"Beule, F., Al Trjman, M., Teutenberg, D., &#38; Meschut, G. (2024). <i>Method development (modelling, simulation, characterisation) in adhesive bonding technology</i>. International Symposium Smart Joining Solutions for Future Mobility, Shanghai.","short":"F. Beule, M. Al Trjman, D. Teutenberg, G. Meschut, in: Shanghai, 2024.","bibtex":"@inproceedings{Beule_Al Trjman_Teutenberg_Meschut_2024, place={Shanghai}, title={Method development (modelling, simulation, characterisation) in adhesive bonding technology}, author={Beule, Felix and Al Trjman, Mohamad and Teutenberg, Dominik and Meschut, Gerson}, year={2024} }","ieee":"F. Beule, M. Al Trjman, D. Teutenberg, and G. Meschut, “Method development (modelling, simulation, characterisation) in adhesive bonding technology,” presented at the International Symposium Smart Joining Solutions for Future Mobility, Shanghai, 2024.","mla":"Beule, Felix, et al. <i>Method Development (Modelling, Simulation, Characterisation) in Adhesive Bonding Technology</i>. 2024."},"year":"2024","user_id":"66192"}