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<titleInfo><title>Method development (modelling, simulation, characterisation) in adhesive bonding technology</title></titleInfo>





<name type="personal">
  <namePart type="given">Felix</namePart>
  <namePart type="family">Beule</namePart>
  <role><roleTerm type="text">author</roleTerm> </role><identifier type="local">66192</identifier></name>
<name type="personal">
  <namePart type="given">Mohamad</namePart>
  <namePart type="family">Al Trjman</namePart>
  <role><roleTerm type="text">author</roleTerm> </role><identifier type="local">65415</identifier></name>
<name type="personal">
  <namePart type="given">Dominik</namePart>
  <namePart type="family">Teutenberg</namePart>
  <role><roleTerm type="text">author</roleTerm> </role><identifier type="local">537</identifier></name>
<name type="personal">
  <namePart type="given">Gerson</namePart>
  <namePart type="family">Meschut</namePart>
  <role><roleTerm type="text">author</roleTerm> </role><identifier type="local">32056</identifier><description xsi:type="identifierDefinition" type="orcid">0000-0002-2763-1246</description></name>







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<name type="conference">
  <namePart>International Symposium Smart Joining Solutions for Future Mobility</namePart>
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<originInfo><dateIssued encoding="w3cdtf">2024</dateIssued><place><placeTerm type="text">Shanghai</placeTerm></place>
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<language><languageTerm authority="iso639-2b" type="code">eng</languageTerm>
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<bibliographicCitation>
<apa>Beule, F., Al Trjman, M., Teutenberg, D., &amp;#38; Meschut, G. (2024). &lt;i&gt;Method development (modelling, simulation, characterisation) in adhesive bonding technology&lt;/i&gt;. International Symposium Smart Joining Solutions for Future Mobility, Shanghai.</apa>
<ama>Beule F, Al Trjman M, Teutenberg D, Meschut G. Method development (modelling, simulation, characterisation) in adhesive bonding technology. In: ; 2024.</ama>
<chicago>Beule, Felix, Mohamad Al Trjman, Dominik Teutenberg, and Gerson Meschut. “Method Development (Modelling, Simulation, Characterisation) in Adhesive Bonding Technology.” Shanghai, 2024.</chicago>
<ieee>F. Beule, M. Al Trjman, D. Teutenberg, and G. Meschut, “Method development (modelling, simulation, characterisation) in adhesive bonding technology,” presented at the International Symposium Smart Joining Solutions for Future Mobility, Shanghai, 2024.</ieee>
<mla>Beule, Felix, et al. &lt;i&gt;Method Development (Modelling, Simulation, Characterisation) in Adhesive Bonding Technology&lt;/i&gt;. 2024.</mla>
<bibtex>@inproceedings{Beule_Al Trjman_Teutenberg_Meschut_2024, place={Shanghai}, title={Method development (modelling, simulation, characterisation) in adhesive bonding technology}, author={Beule, Felix and Al Trjman, Mohamad and Teutenberg, Dominik and Meschut, Gerson}, year={2024} }</bibtex>
<short>F. Beule, M. Al Trjman, D. Teutenberg, G. Meschut, in: Shanghai, 2024.</short>
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