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<titleInfo><title>Integrated Photonic-Assisted Signal Processing and Thermal Crosstalk</title></titleInfo>


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<name type="personal">
  <namePart type="given">Souvaraj</namePart>
  <namePart type="family">De</namePart>
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<name type="personal">
  <namePart type="given">Younus</namePart>
  <namePart type="family">Mandalawi</namePart>
  <role><roleTerm type="text">author</roleTerm> </role></name>
<name type="personal">
  <namePart type="given">Ranjan</namePart>
  <namePart type="family">Das</namePart>
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<name type="personal">
  <namePart type="given">Maxim</namePart>
  <namePart type="family">Weizel</namePart>
  <role><roleTerm type="text">author</roleTerm> </role><identifier type="local">44271</identifier><description xsi:type="identifierDefinition" type="orcid">0000-0003-2699-9839</description></name>







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<name type="corporate">
  <namePart>FOR 2863: Metrologie für die THz Kommunikation (Meteracom)</namePart>
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  <namePart>FOR 2863:  Metrologie für die THz Kommunikation, TP: Ultrabreitbandige Abtastung</namePart>
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  <namePart>FOR 2863:  Metrologie für die THz Kommunikation, TP C3: Skalierbares THz Transceiver Impairment Modell</namePart>
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<abstract lang="eng">Integrated photonic-assisted signal processing has multiple applications such as signal amplification, multiplexing, and high-Q filtering in optical communication systems, optical sensing systems, and also microwave photonics. We will review recent works on integrated photonic-assisted signal processing for sinc-shaped Nyquist pulse generation, high-bandwidth Nyquist signal detection with low bandwidth devices, arbitrary waveform generation and measurement, and on-chip photonic frequency decoding. However, in such photonic integrated circuits (PICs), the photonic components are placed very close to each other on the chip, resulting in thermal crosstalk which degrades the system performance. Air-filled oxide and deep trench designs have proven to be very effective in mitigating the thermal crosstalk for various frequently deployed photonic devices like Mach-Zehnder modulators (MZMs), ring resonators, optical switches, and photodetectors designed on a standard silicon-on-insulator (SOI) platform. In this chapter, we will additionally review the basics of optical signal processing and some results for such trench-enhanced thermal crosstalk resilient circuits.</abstract>

<originInfo><publisher>Springer Nature Switzerland</publisher><dateIssued encoding="w3cdtf">2026</dateIssued>
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<language><languageTerm authority="iso639-2b" type="code">eng</languageTerm>
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<relatedItem type="host"><titleInfo><title>Metrology for THz Communications</title></titleInfo>
  <identifier type="issn">0342-4111</identifier>
  <identifier type="issn">1556-1534</identifier>
  <identifier type="isbn">9783032019851</identifier>
  <identifier type="isbn">9783032019868</identifier><identifier type="doi">10.1007/978-3-032-01986-8_20</identifier>
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<chicago>De, Souvaraj, Younus Mandalawi, Ranjan Das, and Maxim Weizel. “Integrated Photonic-Assisted Signal Processing and Thermal Crosstalk.” In &lt;i&gt;Metrology for THz Communications&lt;/i&gt;. Cham: Springer Nature Switzerland, 2026. &lt;a href=&quot;https://doi.org/10.1007/978-3-032-01986-8_20&quot;&gt;https://doi.org/10.1007/978-3-032-01986-8_20&lt;/a&gt;.</chicago>
<ieee>S. De, Y. Mandalawi, R. Das, and M. Weizel, “Integrated Photonic-Assisted Signal Processing and Thermal Crosstalk,” in &lt;i&gt;Metrology for THz Communications&lt;/i&gt;, Cham: Springer Nature Switzerland, 2026.</ieee>
<ama>De S, Mandalawi Y, Das R, Weizel M. Integrated Photonic-Assisted Signal Processing and Thermal Crosstalk. In: &lt;i&gt;Metrology for THz Communications&lt;/i&gt;. Springer Nature Switzerland; 2026. doi:&lt;a href=&quot;https://doi.org/10.1007/978-3-032-01986-8_20&quot;&gt;10.1007/978-3-032-01986-8_20&lt;/a&gt;</ama>
<apa>De, S., Mandalawi, Y., Das, R., &amp;#38; Weizel, M. (2026). Integrated Photonic-Assisted Signal Processing and Thermal Crosstalk. In &lt;i&gt;Metrology for THz Communications&lt;/i&gt;. Springer Nature Switzerland. &lt;a href=&quot;https://doi.org/10.1007/978-3-032-01986-8_20&quot;&gt;https://doi.org/10.1007/978-3-032-01986-8_20&lt;/a&gt;</apa>
<short>S. De, Y. Mandalawi, R. Das, M. Weizel, in: Metrology for THz Communications, Springer Nature Switzerland, Cham, 2026.</short>
<mla>De, Souvaraj, et al. “Integrated Photonic-Assisted Signal Processing and Thermal Crosstalk.” &lt;i&gt;Metrology for THz Communications&lt;/i&gt;, Springer Nature Switzerland, 2026, doi:&lt;a href=&quot;https://doi.org/10.1007/978-3-032-01986-8_20&quot;&gt;10.1007/978-3-032-01986-8_20&lt;/a&gt;.</mla>
<bibtex>@inbook{De_Mandalawi_Das_Weizel_2026, place={Cham}, title={Integrated Photonic-Assisted Signal Processing and Thermal Crosstalk}, DOI={&lt;a href=&quot;https://doi.org/10.1007/978-3-032-01986-8_20&quot;&gt;10.1007/978-3-032-01986-8_20&lt;/a&gt;}, booktitle={Metrology for THz Communications}, publisher={Springer Nature Switzerland}, author={De, Souvaraj and Mandalawi, Younus and Das, Ranjan and Weizel, Maxim}, year={2026} }</bibtex>
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