{"department":[{"_id":"563"}],"type":"conference","date_created":"2026-10-05T07:33:49Z","citation":{"ieee":"B. Mecke, P. Schuster, J. von Reinersdorff, T. Mager, J. Diri, and R. Dumitrescu, “A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material,” 2026, doi: <a href=\"https://doi.org/10.1109/midcongress66428.2025.11547377\">10.1109/midcongress66428.2025.11547377</a>.","apa":"Mecke, B., Schuster, P., von Reinersdorff, J., Mager, T., Diri, J., &#38; Dumitrescu, R. (2026). A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material. <i>2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress)</i>. <a href=\"https://doi.org/10.1109/midcongress66428.2025.11547377\">https://doi.org/10.1109/midcongress66428.2025.11547377</a>","short":"B. Mecke, P. Schuster, J. von Reinersdorff, T. Mager, J. Diri, R. Dumitrescu, in: 2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress), IEEE, 2026.","chicago":"Mecke, Bruno, Paul Schuster, Johannes von Reinersdorff, Thomas Mager, Jabil Diri, and Roman Dumitrescu. “A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material.” In <i>2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress)</i>. IEEE, 2026. <a href=\"https://doi.org/10.1109/midcongress66428.2025.11547377\">https://doi.org/10.1109/midcongress66428.2025.11547377</a>.","mla":"Mecke, Bruno, et al. “A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material.” <i>2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress)</i>, IEEE, 2026, doi:<a href=\"https://doi.org/10.1109/midcongress66428.2025.11547377\">10.1109/midcongress66428.2025.11547377</a>.","bibtex":"@inproceedings{Mecke_Schuster_von Reinersdorff_Mager_Diri_Dumitrescu_2026, title={A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material}, DOI={<a href=\"https://doi.org/10.1109/midcongress66428.2025.11547377\">10.1109/midcongress66428.2025.11547377</a>}, booktitle={2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress)}, publisher={IEEE}, author={Mecke, Bruno and Schuster, Paul and von Reinersdorff, Johannes and Mager, Thomas and Diri, Jabil and Dumitrescu, Roman}, year={2026} }","ama":"Mecke B, Schuster P, von Reinersdorff J, Mager T, Diri J, Dumitrescu R. A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material. In: <i>2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress)</i>. IEEE; 2026. doi:<a href=\"https://doi.org/10.1109/midcongress66428.2025.11547377\">10.1109/midcongress66428.2025.11547377</a>"},"publication":"2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress)","doi":"10.1109/midcongress66428.2025.11547377","user_id":"15782","_id":"67383","publisher":"IEEE","language":[{"iso":"eng"}],"date_updated":"2026-10-05T07:34:52Z","publication_status":"published","author":[{"last_name":"Mecke","first_name":"Bruno","full_name":"Mecke, Bruno"},{"first_name":"Paul","last_name":"Schuster","full_name":"Schuster, Paul"},{"last_name":"von Reinersdorff","first_name":"Johannes","full_name":"von Reinersdorff, Johannes"},{"full_name":"Mager, Thomas","first_name":"Thomas","last_name":"Mager"},{"full_name":"Diri, Jabil","first_name":"Jabil","last_name":"Diri"},{"id":"16190","full_name":"Dumitrescu, Roman","last_name":"Dumitrescu","first_name":"Roman"}],"status":"public","title":"A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material","year":"2026"}