conference paper published Bruno Mecke author Paul Schuster author Johannes von Reinersdorff author Thomas Mager author Jabil Diri author Roman Dumitrescu author 16190 563 department IEEE2026 eng 10.1109/midcongress66428.2025.11547377 B. Mecke, P. Schuster, J. von Reinersdorff, T. Mager, J. Diri, and R. Dumitrescu, “A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material,” 2026, doi: <a href="https://doi.org/10.1109/midcongress66428.2025.11547377">10.1109/midcongress66428.2025.11547377</a>. Mecke, B., Schuster, P., von Reinersdorff, J., Mager, T., Diri, J., &#38; Dumitrescu, R. (2026). A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material. <i>2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress)</i>. <a href="https://doi.org/10.1109/midcongress66428.2025.11547377">https://doi.org/10.1109/midcongress66428.2025.11547377</a> B. Mecke, P. Schuster, J. von Reinersdorff, T. Mager, J. Diri, R. Dumitrescu, in: 2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress), IEEE, 2026. Mecke, Bruno, Paul Schuster, Johannes von Reinersdorff, Thomas Mager, Jabil Diri, and Roman Dumitrescu. “A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material.” In <i>2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress)</i>. IEEE, 2026. <a href="https://doi.org/10.1109/midcongress66428.2025.11547377">https://doi.org/10.1109/midcongress66428.2025.11547377</a>. Mecke, Bruno, et al. “A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material.” <i>2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress)</i>, IEEE, 2026, doi:<a href="https://doi.org/10.1109/midcongress66428.2025.11547377">10.1109/midcongress66428.2025.11547377</a>. @inproceedings{Mecke_Schuster_von Reinersdorff_Mager_Diri_Dumitrescu_2026, title={A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material}, DOI={<a href="https://doi.org/10.1109/midcongress66428.2025.11547377">10.1109/midcongress66428.2025.11547377</a>}, booktitle={2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress)}, publisher={IEEE}, author={Mecke, Bruno and Schuster, Paul and von Reinersdorff, Johannes and Mager, Thomas and Diri, Jabil and Dumitrescu, Roman}, year={2026} } Mecke B, Schuster P, von Reinersdorff J, Mager T, Diri J, Dumitrescu R. A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material. In: <i>2025 16th International MID Congress Mechatronic Integration Discourse (MID Congress)</i>. IEEE; 2026. doi:<a href="https://doi.org/10.1109/midcongress66428.2025.11547377">10.1109/midcongress66428.2025.11547377</a> 673832026-10-05T07:33:49Z2026-10-05T07:34:52Z