---
_id: '67383'
author:
- first_name: Bruno
  full_name: Mecke, Bruno
  last_name: Mecke
- first_name: Paul
  full_name: Schuster, Paul
  last_name: Schuster
- first_name: Johannes
  full_name: von Reinersdorff, Johannes
  last_name: von Reinersdorff
- first_name: Thomas
  full_name: Mager, Thomas
  last_name: Mager
- first_name: Jabil
  full_name: Diri, Jabil
  last_name: Diri
- first_name: Roman
  full_name: Dumitrescu, Roman
  id: '16190'
  last_name: Dumitrescu
citation:
  ama: 'Mecke B, Schuster P, von Reinersdorff J, Mager T, Diri J, Dumitrescu R. A
    Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies: Evaluating
    Aluminum as a MID Base Material. In: <i>2025 16th International MID Congress Mechatronic
    Integration Discourse (MID Congress)</i>. IEEE; 2026. doi:<a href="https://doi.org/10.1109/midcongress66428.2025.11547377">10.1109/midcongress66428.2025.11547377</a>'
  apa: 'Mecke, B., Schuster, P., von Reinersdorff, J., Mager, T., Diri, J., &#38;
    Dumitrescu, R. (2026). A Comprehensive Study on the Thermal Properties of MID-Lacquer
    Technologies: Evaluating Aluminum as a MID Base Material. <i>2025 16th International
    MID Congress Mechatronic Integration Discourse (MID Congress)</i>. <a href="https://doi.org/10.1109/midcongress66428.2025.11547377">https://doi.org/10.1109/midcongress66428.2025.11547377</a>'
  bibtex: '@inproceedings{Mecke_Schuster_von Reinersdorff_Mager_Diri_Dumitrescu_2026,
    title={A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies:
    Evaluating Aluminum as a MID Base Material}, DOI={<a href="https://doi.org/10.1109/midcongress66428.2025.11547377">10.1109/midcongress66428.2025.11547377</a>},
    booktitle={2025 16th International MID Congress Mechatronic Integration Discourse
    (MID Congress)}, publisher={IEEE}, author={Mecke, Bruno and Schuster, Paul and
    von Reinersdorff, Johannes and Mager, Thomas and Diri, Jabil and Dumitrescu, Roman},
    year={2026} }'
  chicago: 'Mecke, Bruno, Paul Schuster, Johannes von Reinersdorff, Thomas Mager,
    Jabil Diri, and Roman Dumitrescu. “A Comprehensive Study on the Thermal Properties
    of MID-Lacquer Technologies: Evaluating Aluminum as a MID Base Material.” In <i>2025
    16th International MID Congress Mechatronic Integration Discourse (MID Congress)</i>.
    IEEE, 2026. <a href="https://doi.org/10.1109/midcongress66428.2025.11547377">https://doi.org/10.1109/midcongress66428.2025.11547377</a>.'
  ieee: 'B. Mecke, P. Schuster, J. von Reinersdorff, T. Mager, J. Diri, and R. Dumitrescu,
    “A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies:
    Evaluating Aluminum as a MID Base Material,” 2026, doi: <a href="https://doi.org/10.1109/midcongress66428.2025.11547377">10.1109/midcongress66428.2025.11547377</a>.'
  mla: 'Mecke, Bruno, et al. “A Comprehensive Study on the Thermal Properties of MID-Lacquer
    Technologies: Evaluating Aluminum as a MID Base Material.” <i>2025 16th International
    MID Congress Mechatronic Integration Discourse (MID Congress)</i>, IEEE, 2026,
    doi:<a href="https://doi.org/10.1109/midcongress66428.2025.11547377">10.1109/midcongress66428.2025.11547377</a>.'
  short: 'B. Mecke, P. Schuster, J. von Reinersdorff, T. Mager, J. Diri, R. Dumitrescu,
    in: 2025 16th International MID Congress Mechatronic Integration Discourse (MID
    Congress), IEEE, 2026.'
date_created: 2026-10-05T07:33:49Z
date_updated: 2026-10-05T07:34:52Z
department:
- _id: '563'
doi: 10.1109/midcongress66428.2025.11547377
language:
- iso: eng
publication: 2025 16th International MID Congress Mechatronic Integration Discourse
  (MID Congress)
publication_status: published
publisher: IEEE
status: public
title: 'A Comprehensive Study on the Thermal Properties of MID-Lacquer Technologies:
  Evaluating Aluminum as a MID Base Material'
type: conference
user_id: '15782'
year: '2026'
...