{"date_created":"2019-05-13T13:55:36Z","citation":{"short":"S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: IMAPS 2013, 46th International Symposium on Microelectronics, Orlando (Florida), USA, 2013.","chicago":"Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “A Friction Based Approach for Modeling Wire Bonding.” In <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>. Orlando (Florida), USA, 2013. <a href=\"https://doi.org/10.4071/isom-2013-TA67\">https://doi.org/10.4071/isom-2013-TA67</a>.","bibtex":"@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2013, place={Orlando (Florida), USA}, title={A friction based approach for modeling wire bonding}, DOI={<a href=\"https://doi.org/10.4071/isom-2013-TA67\">10.4071/isom-2013-TA67</a>}, booktitle={IMAPS 2013, 46th International Symposium on Microelectronics}, author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2013} }","apa":"Althoff, S., Neuhaus, J., Hemsel, T., &#38; Sextro, W. (2013). A friction based approach for modeling wire bonding. In <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>. Orlando (Florida), USA. <a href=\"https://doi.org/10.4071/isom-2013-TA67\">https://doi.org/10.4071/isom-2013-TA67</a>","ama":"Althoff S, Neuhaus J, Hemsel T, Sextro W. A friction based approach for modeling wire bonding. In: <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>. Orlando (Florida), USA; 2013. doi:<a href=\"https://doi.org/10.4071/isom-2013-TA67\">10.4071/isom-2013-TA67</a>","mla":"Althoff, Simon, et al. “A Friction Based Approach for Modeling Wire Bonding.” <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>, 2013, doi:<a href=\"https://doi.org/10.4071/isom-2013-TA67\">10.4071/isom-2013-TA67</a>.","ieee":"S. Althoff, J. Neuhaus, T. Hemsel, and W. Sextro, “A friction based approach for modeling wire bonding,” in <i>IMAPS 2013, 46th International Symposium on Microelectronics</i>, 2013."},"user_id":"55222","department":[{"_id":"151"}],"_id":"9797","title":"A friction based approach for modeling wire bonding","keyword":["Wire bonding","friction modeling","wire bond quality","contact element modeling"],"author":[{"last_name":"Althoff","full_name":"Althoff, Simon","first_name":"Simon"},{"first_name":"Jan","full_name":"Neuhaus, Jan","last_name":"Neuhaus"},{"first_name":"Tobias","last_name":"Hemsel","id":"210","full_name":"Hemsel, Tobias"},{"id":"21220","last_name":"Sextro","full_name":"Sextro, Walter","first_name":"Walter"}],"abstract":[{"lang":"eng","text":"A model approach for wedge/wedge bonding copper wire is presented. The connection between wire and substrate is based on a variety of physical effects, but the dominant one is the friction based welding while applying ultrasound. Consequently, a friction model was used to investigate the welding process. This model is built up universal and can be used to describe the formation of micro welds in the time variant contact area between wire and substrate. Aim of the model is to identify the interactions between touchdown, bond normal force, ultrasonic power and bonding time. To do so, the contact area is discretized into partial areas where a Point Contact Model is applied. Based on this approach it is possible to simulate micro and macro slip inside the contact area between wire and substrate. The work done by friction force is a main criterion to define occurring micro joints which influence the subsequent welding."}],"place":"Orlando (Florida), USA","year":"2013","status":"public","publication":"IMAPS 2013, 46th International Symposium on Microelectronics","type":"conference","date_updated":"2022-01-06T07:04:20Z","doi":"10.4071/isom-2013-TA67","language":[{"iso":"eng"}]}