---
_id: '9871'
abstract:
- lang: eng
text: 'Wire bonding is the most common technology for connecting electronic components.
Due to their efficiency bond interconnections made of copper wire are used for
example in the aerospace and medical technology as well as in the fields of renewable
energies. One of the main cost factors in the manufacturing process is the consumables
like bonding tools. The technological transition to copper as wire material causes
significant wear on the millimeter large effective contact area of the bonding
tool. This wear leads to a loss by a factor of 30 of the number of reliable interconnections
which can be produced by a single tool. To reduce setting-up time in the production
and minimizing costs, an enlarged bonding tool lifetime is desirable. Consequently
a better understanding of wear and recognition of wear pattern is required. Therefore,
the paper presents an analyzing method of the tool topography change of a heavy
wire bonding tool by using a confocal microscope. Furthermore, the paper discusses
the identification of the main wear indicators by the help of the named topography
change for different bond parameters, like ultrasonic power and tool geometry.
Reference topography has been carried out by choosing typical parameters of the
production line. To judge whether the quality requirement of the bond connections
made by a single tool cannot be fulfilled shear test of the source bond have been
carried out after a defined number of produced bond connections. Main steps of
analysis: (I)Topography of the tool surface is sampled after a defined number
of bonds by means of a confocal microscope to detect the wear progress.(II)The
recorded data is filtered using Matlab. So, measurement errors can be eliminated
and the topography can be overlaid more easy to identify differences between diverse
tools or differences in wear stages of the same tool.(III)The subsequent discretization
of the topography into sub volumes allows to (IV)describe the loss of volume depending
on the position in the groove. Thereby, intermediate status of wear of one tool
can be used to obtain a persistent description of the topography change over the
number of produced bonds by interpolating the confocal data. Afterwards the persistent
change of the groove flank has been analyzed for the named test series to identify
the main wear indicators and their effect on shear forces. All worn tools show
dominant areas for volume loss especially for plastic deformation and accordingly
abrasion. These wear mechanism can be referred to the change of main parts of
the groove geometry like the rounding of the front and back radius. The most volume
loss was identified in the upper part of the tool flanks or rather at the transition
from the groove flank to the front or back radius. Furthermore the observation
of the center of the groove flank shows just a little change in volume. All in
all, the identification of the wear indicators will be discussed with the objective
of increasing the tool lifetime by optimizing the tool geometry without losses
in bond quality and reliability.'
author:
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Simon
full_name: Althof, Simon
last_name: Althof
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Eichwald P, Sextro W, Althof S, et al. Analysis Method of Tool Topography
Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.
In: Proceedings of the 47th International Symposium on Microelectronics.
; 2014:856-861. doi:10.4071/isom-THP34'
apa: Eichwald, P., Sextro, W., Althof, S., Eacock, F., Unger, A., Meyer, T., &
Guth, K. (2014). Analysis Method of Tool Topography Change and Identification
of Wear Indicators for Heavy Copper Wire Wedge Bonding. In Proceedings of the
47th International Symposium on Microelectronics (pp. 856–861). https://doi.org/10.4071/isom-THP34
bibtex: '@inproceedings{Eichwald_Sextro_Althof_Eacock_Unger_Meyer_Guth_2014, title={Analysis
Method of Tool Topography Change and Identification of Wear Indicators for Heavy
Copper Wire Wedge Bonding}, DOI={10.4071/isom-THP34},
booktitle={Proceedings of the 47th International Symposium on Microelectronics},
author={Eichwald, Paul and Sextro, Walter and Althof, Simon and Eacock, Florian
and Unger, Andreas and Meyer, Tobias and Guth, Karsten}, year={2014}, pages={856–861}
}'
chicago: Eichwald, Paul, Walter Sextro, Simon Althof, Florian Eacock, Andreas Unger,
Tobias Meyer, and Karsten Guth. “Analysis Method of Tool Topography Change and
Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” In Proceedings
of the 47th International Symposium on Microelectronics, 856–61, 2014. https://doi.org/10.4071/isom-THP34.
ieee: P. Eichwald et al., “Analysis Method of Tool Topography Change and
Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding,” in Proceedings
of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.
mla: Eichwald, Paul, et al. “Analysis Method of Tool Topography Change and Identification
of Wear Indicators for Heavy Copper Wire Wedge Bonding.” Proceedings of the
47th International Symposium on Microelectronics, 2014, pp. 856–61, doi:10.4071/isom-THP34.
short: 'P. Eichwald, W. Sextro, S. Althof, F. Eacock, A. Unger, T. Meyer, K. Guth,
in: Proceedings of the 47th International Symposium on Microelectronics, 2014,
pp. 856–861.'
date_created: 2019-05-20T12:18:55Z
date_updated: 2020-05-07T05:33:45Z
department:
- _id: '151'
doi: 10.4071/isom-THP34
keyword:
- wedge/wedge bonding
- copper wire
- tool wear
language:
- iso: eng
page: 856-861
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Proceedings of the 47th International Symposium on Microelectronics
status: public
title: Analysis Method of Tool Topography Change and Identification of Wear Indicators
for Heavy Copper Wire Wedge Bonding
type: conference
user_id: '210'
year: '2014'
...