---
_id: '9871'
abstract:
- lang: eng
  text: 'Wire bonding is the most common technology for connecting electronic components.
    Due to their efficiency bond interconnections made of copper wire are used for
    example in the aerospace and medical technology as well as in the fields of renewable
    energies. One of the main cost factors in the manufacturing process is the consumables
    like bonding tools. The technological transition to copper as wire material causes
    significant wear on the millimeter large effective contact area of the bonding
    tool. This wear leads to a loss by a factor of 30 of the number of reliable interconnections
    which can be produced by a single tool. To reduce setting-up time in the production
    and minimizing costs, an enlarged bonding tool lifetime is desirable. Consequently
    a better understanding of wear and recognition of wear pattern is required. Therefore,
    the paper presents an analyzing method of the tool topography change of a heavy
    wire bonding tool by using a confocal microscope. Furthermore, the paper discusses
    the identification of the main wear indicators by the help of the named topography
    change for different bond parameters, like ultrasonic power and tool geometry.
    Reference topography has been carried out by choosing typical parameters of the
    production line. To judge whether the quality requirement of the bond connections
    made by a single tool cannot be fulfilled shear test of the source bond have been
    carried out after a defined number of produced bond connections. Main steps of
    analysis: (I)Topography of the tool surface is sampled after a defined number
    of bonds by means of a confocal microscope to detect the wear progress.(II)The
    recorded data is filtered using Matlab. So, measurement errors can be eliminated
    and the topography can be overlaid more easy to identify differences between diverse
    tools or differences in wear stages of the same tool.(III)The subsequent discretization
    of the topography into sub volumes allows to (IV)describe the loss of volume depending
    on the position in the groove. Thereby, intermediate status of wear of one tool
    can be used to obtain a persistent description of the topography change over the
    number of produced bonds by interpolating the confocal data. Afterwards the persistent
    change of the groove flank has been analyzed for the named test series to identify
    the main wear indicators and their effect on shear forces. All worn tools show
    dominant areas for volume loss especially for plastic deformation and accordingly
    abrasion. These wear mechanism can be referred to the change of main parts of
    the groove geometry like the rounding of the front and back radius. The most volume
    loss was identified in the upper part of the tool flanks or rather at the transition
    from the groove flank to the front or back radius. Furthermore the observation
    of the center of the groove flank shows just a little change in volume. All in
    all, the identification of the wear indicators will be discussed with the objective
    of increasing the tool lifetime by optimizing the tool geometry without losses
    in bond quality and reliability.'
author:
- first_name: Paul
  full_name: Eichwald, Paul
  last_name: Eichwald
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Simon
  full_name: Althof, Simon
  last_name: Althof
- first_name: Florian
  full_name: Eacock, Florian
  last_name: Eacock
- first_name: Andreas
  full_name: Unger, Andreas
  last_name: Unger
- first_name: Tobias
  full_name: Meyer, Tobias
  last_name: Meyer
- first_name: Karsten
  full_name: Guth, Karsten
  last_name: Guth
citation:
  ama: 'Eichwald P, Sextro W, Althof S, et al. Analysis Method of Tool Topography
    Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.
    In: <i>Proceedings of the 47th International Symposium on Microelectronics</i>.
    ; 2014:856-861. doi:<a href="https://doi.org/10.4071/isom-THP34">10.4071/isom-THP34</a>'
  apa: Eichwald, P., Sextro, W., Althof, S., Eacock, F., Unger, A., Meyer, T., &#38;
    Guth, K. (2014). Analysis Method of Tool Topography Change and Identification
    of Wear Indicators for Heavy Copper Wire Wedge Bonding. In <i>Proceedings of the
    47th International Symposium on Microelectronics</i> (pp. 856–861). <a href="https://doi.org/10.4071/isom-THP34">https://doi.org/10.4071/isom-THP34</a>
  bibtex: '@inproceedings{Eichwald_Sextro_Althof_Eacock_Unger_Meyer_Guth_2014, title={Analysis
    Method of Tool Topography Change and Identification of Wear Indicators for Heavy
    Copper Wire Wedge Bonding}, DOI={<a href="https://doi.org/10.4071/isom-THP34">10.4071/isom-THP34</a>},
    booktitle={Proceedings of the 47th International Symposium on Microelectronics},
    author={Eichwald, Paul and Sextro, Walter and Althof, Simon and Eacock, Florian
    and Unger, Andreas and Meyer, Tobias and Guth, Karsten}, year={2014}, pages={856–861}
    }'
  chicago: Eichwald, Paul, Walter Sextro, Simon Althof, Florian Eacock, Andreas Unger,
    Tobias Meyer, and Karsten Guth. “Analysis Method of Tool Topography Change and
    Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding.” In <i>Proceedings
    of the 47th International Symposium on Microelectronics</i>, 856–61, 2014. <a
    href="https://doi.org/10.4071/isom-THP34">https://doi.org/10.4071/isom-THP34</a>.
  ieee: P. Eichwald <i>et al.</i>, “Analysis Method of Tool Topography Change and
    Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding,” in <i>Proceedings
    of the 47th International Symposium on Microelectronics</i>, 2014, pp. 856–861.
  mla: Eichwald, Paul, et al. “Analysis Method of Tool Topography Change and Identification
    of Wear Indicators for Heavy Copper Wire Wedge Bonding.” <i>Proceedings of the
    47th International Symposium on Microelectronics</i>, 2014, pp. 856–61, doi:<a
    href="https://doi.org/10.4071/isom-THP34">10.4071/isom-THP34</a>.
  short: 'P. Eichwald, W. Sextro, S. Althof, F. Eacock, A. Unger, T. Meyer, K. Guth,
    in: Proceedings of the 47th International Symposium on Microelectronics, 2014,
    pp. 856–861.'
date_created: 2019-05-20T12:18:55Z
date_updated: 2020-05-07T05:33:45Z
department:
- _id: '151'
doi: 10.4071/isom-THP34
keyword:
- wedge/wedge bonding
- copper wire
- tool wear
language:
- iso: eng
page: 856-861
project:
- _id: '92'
  grant_number: 02 PQ2210
  name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Proceedings of the 47th International Symposium on Microelectronics
status: public
title: Analysis Method of Tool Topography Change and Identification of Wear Indicators
  for Heavy Copper Wire Wedge Bonding
type: conference
user_id: '210'
year: '2014'
...