{"type":"journal_article","page":"512-519","title":"Kupferbondverbindungen intelligent herstellen","date_created":"2019-05-27T08:53:18Z","publication":"wt-online","date_updated":"2020-05-07T05:33:52Z","status":"public","author":[{"first_name":"Michael","last_name":"Brökelmann","full_name":"Brökelmann, Michael"},{"full_name":"Unger, Andreas","last_name":"Unger","first_name":"Andreas"},{"first_name":"Tobias","last_name":"Meyer","full_name":"Meyer, Tobias"},{"first_name":"Simon","last_name":"Althoff","full_name":"Althoff, Simon"},{"full_name":"Sextro, Walter","last_name":"Sextro","first_name":"Walter","id":"21220"},{"last_name":"Hunstig","full_name":"Hunstig, Matthias","first_name":"Matthias"},{"last_name":"Biermann","full_name":"Biermann, Florian","first_name":"Florian"},{"first_name":"Karsten","last_name":"Guth","full_name":"Guth, Karsten"}],"popular_science":"1","year":"2016","language":[{"iso":"eng"}],"_id":"9957","abstract":[{"text":"Leistungshalbleitermodule werden leistungsfähiger, effizienter, kompakter und haltbarer Ziel dieses Innovationsprojekts des Spitzenclusters „it’s OWL – Intelligente Technische Systeme OstWestfalen-Lippe“ ist die Entwicklung von selbstoptimierenden Verfahren, um unter variablen Produktionsbedingungen zuverlässige Kupferbondverbindungen herstellen zu können. Die Ultraschall-Drahtbondmaschine erhält die Fähigkeit, sich automatisch an veränderte Bedingungen anzupassen. Hierzu wird der gesamte Prozess der Ultraschall-Verbindungsbildung modelliert und neueste Verfahren der Selbstoptimierung angewandt. Die Evaluierung erfolgt anhand eines Prototypen in Form einer modifizierten Bondmaschine. Intelligent production of heavy copper wire bonds It is the aim of this innovation-project to develop a self-optimization system for ultrasonic copper wire bonding. It is part of the leading edge cluster “it’s OWL”. The bonding machine will be able to react autonomously to changing boundary conditions to ensure constant and reliable bonding results. For this, the hole bonding process is modeled in great detail and newest self-optimization techniques are utilized. A prototype-system incorporated in a serial machine is used for evaluation.","lang":"eng"}],"volume":"7/8","project":[{"grant_number":"02 PQ2210","_id":"92","name":"Intelligente Herstellung zuverlässiger Kupferbondverbindungen"}],"department":[{"_id":"151"}],"user_id":"210","citation":{"short":"M. Brökelmann, A. Unger, T. Meyer, S. Althoff, W. Sextro, M. Hunstig, F. Biermann, K. Guth, Wt-Online 7/8 (2016) 512–519.","mla":"Brökelmann, Michael, et al. “Kupferbondverbindungen Intelligent Herstellen.” <i>Wt-Online</i>, vol. 7/8, 2016, pp. 512–19.","bibtex":"@article{Brökelmann_Unger_Meyer_Althoff_Sextro_Hunstig_Biermann_Guth_2016, title={Kupferbondverbindungen intelligent herstellen}, volume={7/8}, journal={wt-online}, author={Brökelmann, Michael and Unger, Andreas and Meyer, Tobias and Althoff, Simon and Sextro, Walter and Hunstig, Matthias and Biermann, Florian and Guth, Karsten}, year={2016}, pages={512–519} }","ama":"Brökelmann M, Unger A, Meyer T, et al. Kupferbondverbindungen intelligent herstellen. <i>wt-online</i>. 2016;7/8:512-519.","ieee":"M. Brökelmann <i>et al.</i>, “Kupferbondverbindungen intelligent herstellen,” <i>wt-online</i>, vol. 7/8, pp. 512–519, 2016.","chicago":"Brökelmann, Michael, Andreas Unger, Tobias Meyer, Simon Althoff, Walter Sextro, Matthias Hunstig, Florian Biermann, and Karsten Guth. “Kupferbondverbindungen Intelligent Herstellen.” <i>Wt-Online</i> 7/8 (2016): 512–19.","apa":"Brökelmann, M., Unger, A., Meyer, T., Althoff, S., Sextro, W., Hunstig, M., … Guth, K. (2016). Kupferbondverbindungen intelligent herstellen. <i>Wt-Online</i>, <i>7/8</i>, 512–519."}}