---
_id: '9960'
abstract:
- lang: eng
text: Ultrasonic wire bonding is a common technology for connecting electrodes of
electronic components like power modules. Nowadays, bond connections are often
made of copper instead of aluminum due to its thermal and mechanical assets. One
of the main cost factors in the wire bonding process is the acquisition cost of
consumables such as bonding tools. For copper wire bonding tool lifetime is much
lower than for aluminium bonding. This paper presents a micro wear model for wedge/wedge
bonding tools that was validated by observing wear patterns with a scanning electron
microscope. The wear coefficient is determined in long-term bonding tests. The
application of Fleischer´s wear approach incorporating frictional power to a finite
element simulation of the bonding processes is used to shift element nodes depending
on the rising frictional power for finite element modeling. The presented simulation
method can be used to take tool wear into consideration for creating tools with
increased lifetime. This enables the production of reliable bond connections using
heavy as well as thin wire of any material. The paper discusses the predominant
influences of wear on the main tool functions and their changes over tool life.
Furthermore, the influence of the tool groove angle on the tool wear was investigated.
One of the main results is that the wear is largest during the last phase of each
bonding process, when the contact area between tool and wire is largest.
author:
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
citation:
ama: 'Eichwald P, Unger A, Eacock F, et al. Micro Wear Modeling in Copper Wire Wedge
Bonding. In: IEEE CPMT Symposium Japan, 2016. ; 2016.'
apa: Eichwald, P., Unger, A., Eacock, F., Althoff, S., Sextro, W., Guth, K., &
Brökelmann, M. (2016). Micro Wear Modeling in Copper Wire Wedge Bonding. In IEEE
CPMT Symposium Japan, 2016.
bibtex: '@inproceedings{Eichwald_Unger_Eacock_Althoff_Sextro_Guth_Brökelmann_2016,
title={Micro Wear Modeling in Copper Wire Wedge Bonding}, booktitle={IEEE CPMT
Symposium Japan, 2016}, author={Eichwald, Paul and Unger, Andreas and Eacock,
Florian and Althoff, Simon and Sextro, Walter and Guth, Karsten and Brökelmann,
Michael}, year={2016} }'
chicago: Eichwald, Paul, Andreas Unger, Florian Eacock, Simon Althoff, Walter Sextro,
Karsten Guth, and Michael Brökelmann. “Micro Wear Modeling in Copper Wire Wedge
Bonding.” In IEEE CPMT Symposium Japan, 2016, 2016.
ieee: P. Eichwald et al., “Micro Wear Modeling in Copper Wire Wedge Bonding,”
in IEEE CPMT Symposium Japan, 2016, 2016.
mla: Eichwald, Paul, et al. “Micro Wear Modeling in Copper Wire Wedge Bonding.”
IEEE CPMT Symposium Japan, 2016, 2016.
short: 'P. Eichwald, A. Unger, F. Eacock, S. Althoff, W. Sextro, K. Guth, M. Brökelmann,
in: IEEE CPMT Symposium Japan, 2016, 2016.'
date_created: 2019-05-27T09:07:19Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
language:
- iso: eng
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: IEEE CPMT Symposium Japan, 2016
quality_controlled: '1'
status: public
title: Micro Wear Modeling in Copper Wire Wedge Bonding
type: conference
user_id: '210'
year: '2016'
...