--- _id: '9968' abstract: - lang: eng text: To increase quality and reliability of copper wire bonds, self-optimization is a promising technique. For the implementation of self-optimization for ultrasonic heavy copper wire bonding machines, a model of stick-slip motion between tool and wire and between wire and substrate during the bonding process is essential. Investigations confirm that both of these contacts do indeed show stick-slip movement in each period oscillation. In a first step, this paper shows the importance of modeling the stick-slip effect by determining, monitoring and analyzing amplitudes and phase angles of tooltip, wire and substrate experimentally during bonding via laser measurements. In a second step, the paper presents a dynamic model which has been parameterized using an iterative numerical parameter identification method. This model includes Archard’s wear approach in order to compute the lost volume of tool tip due to wear over the entire process time. A validation of the model by comparing measured and calculated amplitudes of tool tip and wire reveals high model quality. Then it is then possible to calculate the lifetime of the tool for different process parameters, i.e. values of normal force and ultrasonic voltage. author: - first_name: Andreas full_name: Unger, Andreas last_name: Unger - first_name: Reinhard full_name: Schemmel, Reinhard id: '28647' last_name: Schemmel - first_name: Tobias full_name: Meyer, Tobias last_name: Meyer - first_name: Florian full_name: Eacock, Florian last_name: Eacock - first_name: Paul full_name: Eichwald, Paul last_name: Eichwald - first_name: Simon full_name: Althoff, Simon last_name: Althoff - first_name: Walter full_name: Sextro, Walter id: '21220' last_name: Sextro - first_name: Michael full_name: Brökelmann, Michael last_name: Brökelmann - first_name: Matthias full_name: Hunstig, Matthias last_name: Hunstig - first_name: Karsten full_name: Guth, Karsten last_name: Guth citation: ama: 'Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic Wire Bonding Process. In: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016. IEEE CPMT Symposium Japan; 2016:251-254.' apa: Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S., … Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process. In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016 (pp. 251–254). IEEE CPMT Symposium Japan. bibtex: '@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016, place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten}, year={2016}, pages={251–254} }' chicago: Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald, Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 251–54. IEEE CPMT Symposium Japan, 2016. ieee: A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 2016, pp. 251–254. mla: Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding Process.” Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 2016, pp. 251–54. short: 'A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.' date_created: 2019-05-27T09:20:10Z date_updated: 2020-05-07T05:33:53Z department: - _id: '151' keyword: - the Ultrasonic Wire Bonding Process language: - iso: eng page: 251-254 place: IEEE CPMT Symposium Japan project: - _id: '92' grant_number: 02 PQ2210 name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen publication: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016 quality_controlled: '1' status: public title: Validated Simulation of the Ultrasonic Wire Bonding Process type: conference user_id: '210' year: '2016' ...