---
_id: '9968'
abstract:
- lang: eng
text: To increase quality and reliability of copper wire bonds, self-optimization
is a promising technique. For the implementation of self-optimization for ultrasonic
heavy copper wire bonding machines, a model of stick-slip motion between tool
and wire and between wire and substrate during the bonding process is essential.
Investigations confirm that both of these contacts do indeed show stick-slip movement
in each period oscillation. In a first step, this paper shows the importance of
modeling the stick-slip effect by determining, monitoring and analyzing amplitudes
and phase angles of tooltip, wire and substrate experimentally during bonding
via laser measurements. In a second step, the paper presents a dynamic model which
has been parameterized using an iterative numerical parameter identification method.
This model includes Archard’s wear approach in order to compute the lost volume
of tool tip due to wear over the entire process time. A validation of the model
by comparing measured and calculated amplitudes of tool tip and wire reveals high
model quality. Then it is then possible to calculate the lifetime of the tool
for different process parameters, i.e. values of normal force and ultrasonic voltage.
author:
- first_name: Andreas
full_name: Unger, Andreas
last_name: Unger
- first_name: Reinhard
full_name: Schemmel, Reinhard
id: '28647'
last_name: Schemmel
- first_name: Tobias
full_name: Meyer, Tobias
last_name: Meyer
- first_name: Florian
full_name: Eacock, Florian
last_name: Eacock
- first_name: Paul
full_name: Eichwald, Paul
last_name: Eichwald
- first_name: Simon
full_name: Althoff, Simon
last_name: Althoff
- first_name: Walter
full_name: Sextro, Walter
id: '21220'
last_name: Sextro
- first_name: Michael
full_name: Brökelmann, Michael
last_name: Brökelmann
- first_name: Matthias
full_name: Hunstig, Matthias
last_name: Hunstig
- first_name: Karsten
full_name: Guth, Karsten
last_name: Guth
citation:
ama: 'Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic
Wire Bonding Process. In: Wear Modeling in Copper Wire Wedge Bonding. IEEE
CPMT Symposium Japan, 2016. IEEE CPMT Symposium Japan; 2016:251-254.'
apa: Unger, A., Schemmel, R., Meyer, T., Eacock, F., Eichwald, P., Althoff, S.,
… Guth, K. (2016). Validated Simulation of the Ultrasonic Wire Bonding Process.
In Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016
(pp. 251–254). IEEE CPMT Symposium Japan.
bibtex: '@inproceedings{Unger_Schemmel_Meyer_Eacock_Eichwald_Althoff_Sextro_Brökelmann_Hunstig_Guth_2016,
place={IEEE CPMT Symposium Japan}, title={Validated Simulation of the Ultrasonic
Wire Bonding Process}, booktitle={Wear Modeling in Copper Wire Wedge Bonding.
IEEE CPMT Symposium Japan, 2016}, author={Unger, Andreas and Schemmel, Reinhard
and Meyer, Tobias and Eacock, Florian and Eichwald, Paul and Althoff, Simon and
Sextro, Walter and Brökelmann, Michael and Hunstig, Matthias and Guth, Karsten},
year={2016}, pages={251–254} }'
chicago: Unger, Andreas, Reinhard Schemmel, Tobias Meyer, Florian Eacock, Paul Eichwald,
Simon Althoff, Walter Sextro, Michael Brökelmann, Matthias Hunstig, and Karsten
Guth. “Validated Simulation of the Ultrasonic Wire Bonding Process.” In Wear
Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, 251–54.
IEEE CPMT Symposium Japan, 2016.
ieee: A. Unger et al., “Validated Simulation of the Ultrasonic Wire Bonding
Process,” in Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium
Japan, 2016, 2016, pp. 251–254.
mla: Unger, Andreas, et al. “Validated Simulation of the Ultrasonic Wire Bonding
Process.” Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016, 2016, pp. 251–54.
short: 'A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W.
Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge
Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp.
251–254.'
date_created: 2019-05-27T09:20:10Z
date_updated: 2020-05-07T05:33:53Z
department:
- _id: '151'
keyword:
- the Ultrasonic Wire Bonding Process
language:
- iso: eng
page: 251-254
place: IEEE CPMT Symposium Japan
project:
- _id: '92'
grant_number: 02 PQ2210
name: Intelligente Herstellung zuverlässiger Kupferbondverbindungen
publication: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan,
2016
quality_controlled: '1'
status: public
title: Validated Simulation of the Ultrasonic Wire Bonding Process
type: conference
user_id: '210'
year: '2016'
...