---
res:
  bibo_abstract:
  - State-of-the-art industrial compact high power electronic packages require copper-copper
    interconnections with larger cross sections made by ultrasonic bonding. In comparison
    to aluminium-copper, copper-copper interconnections require increased normal forces
    and ultrasonic power, which might lead to substrate damage due to increased mechanical
    stresses. One option to raise friction energy without increasing vibration amplitude
    between wire and substrate or bonding force is the use of two-dimensional vibration.
    The first part of this contribution reports on the development of a novel bonding
    system that executes two-dimensional vibrations of a tool-tip to bond a nail-
    like pin onto a copper substrate. Since intermetallic bonds only form properly
    when surfaces are clean, oxide free and activated, the geometries of tool-tip
    and pin were optimised using finite element analysis. To maximize the area of
    the bonded annulus the distribution of normal pressure was optimized by varying
    the convexity of the bottom side of the pin. Second, a statistical model obtained
    from an experimental parameter study shows the influence of different bonding
    parameters on the bond result. To find bonding parameters with the minimum number
    of tests, the experiments have been planned using a D-optimal experimental design
    approach.@eng
  bibo_authorlist:
  - foaf_Person:
      foaf_givenName: Collin
      foaf_name: Dymel, Collin
      foaf_surname: Dymel
      foaf_workInfoHomepage: http://www.librecat.org/personId=66833
  - foaf_Person:
      foaf_givenName: Paul
      foaf_name: Eichwald, Paul
      foaf_surname: Eichwald
  - foaf_Person:
      foaf_givenName: Reinhard
      foaf_name: Schemmel, Reinhard
      foaf_surname: Schemmel
      foaf_workInfoHomepage: http://www.librecat.org/personId=28647
  - foaf_Person:
      foaf_givenName: Tobias
      foaf_name: Hemsel, Tobias
      foaf_surname: Hemsel
      foaf_workInfoHomepage: http://www.librecat.org/personId=210
  - foaf_Person:
      foaf_givenName: Michael
      foaf_name: Brökelmann, Michael
      foaf_surname: Brökelmann
  - foaf_Person:
      foaf_givenName: Matthias
      foaf_name: Hunstig, Matthias
      foaf_surname: Hunstig
  - foaf_Person:
      foaf_givenName: Walter
      foaf_name: Sextro, Walter
      foaf_surname: Sextro
      foaf_workInfoHomepage: http://www.librecat.org/personId=21220
  dct_date: 2018^xs_gYear
  dct_language: eng
  dct_subject:
  - ultrasonic wire-bonding
  - bond-tool design
  - parameter identification
  - statistical engineering
  dct_title: Numerical and statistical investigation of weld formation in a novel
    two-dimensional copper-copper bonding process@
...