---
res:
  bibo_abstract:
  - Ultrasonic wire bonding is used to connect the electrical terminals of semiconductor
    modules in power electronics. Mul- tiple inﬂuencing factors in wedge/wedge bonding
    are known and extensively investigated. A constructively settable but rarely examined
    parameter is the bonding frequency. In case of bonding on challenging substrates,
    e.g. supple substruc- tures, a high inﬂuence of the working frequency is observed.
    The choice of the working frequency is typically based on experimental investigations
    for a certain component or substrate and needs to be evaluated anew for new applications.
    A profound understanding of the inﬂuence of the working frequency is required
    to achieve a reliable bond process and a short process development. Here a generalized
    model for the numerical simulation of the bond formation with respect to the dynamics
    of the substructure is presented. The simulation results are compared to experiments
    using 300 µm copper wire at different working frequencies and geometries of the
    substructure.@eng
  bibo_authorlist:
  - foaf_Person:
      foaf_givenName: Reinhard
      foaf_name: Schemmel, Reinhard
      foaf_surname: Schemmel
      foaf_workInfoHomepage: http://www.librecat.org/personId=28647
  - foaf_Person:
      foaf_givenName: Simon
      foaf_name: Althoff, Simon
      foaf_surname: Althoff
  - foaf_Person:
      foaf_givenName: Walter
      foaf_name: Sextro, Walter
      foaf_surname: Sextro
      foaf_workInfoHomepage: http://www.librecat.org/personId=21220
  - foaf_Person:
      foaf_givenName: Andreas
      foaf_name: Unger, Andreas
      foaf_surname: Unger
  - foaf_Person:
      foaf_givenName: Michael
      foaf_name: Brökelmann, Michael
      foaf_surname: Brökelmann
  - foaf_Person:
      foaf_givenName: Matthias
      foaf_name: Hunstig, Matthias
      foaf_surname: Hunstig
  dct_date: 2018^xs_gYear
  dct_language: eng
  dct_title: Effects of different working frequencies on the joint formation in copper
    wire bonding@
...