---
_id: '9997'
abstract:
- lang: eng
  text: Ultrasonic wire bonding is used to connect the electrical terminals of semiconductor
    modules in power electronics. Mul- tiple influencing factors in wedge/wedge bonding
    are known and extensively investigated. A constructively settable but rarely examined
    parameter is the bonding frequency. In case of bonding on challenging substrates,
    e.g. supple substruc- tures, a high influence of the working frequency is observed.
    The choice of the working frequency is typically based on experimental investigations
    for a certain component or substrate and needs to be evaluated anew for new applications.
    A profound understanding of the influence of the working frequency is required
    to achieve a reliable bond process and a short process development. Here a generalized
    model for the numerical simulation of the bond formation with respect to the dynamics
    of the substructure is presented. The simulation results are compared to experiments
    using 300 µm copper wire at different working frequencies and geometries of the
    substructure.
author:
- first_name: Reinhard
  full_name: Schemmel, Reinhard
  id: '28647'
  last_name: Schemmel
- first_name: Simon
  full_name: Althoff, Simon
  last_name: Althoff
- first_name: Walter
  full_name: Sextro, Walter
  id: '21220'
  last_name: Sextro
- first_name: Andreas
  full_name: Unger, Andreas
  last_name: Unger
- first_name: Michael
  full_name: Brökelmann, Michael
  last_name: Brökelmann
- first_name: Matthias
  full_name: Hunstig, Matthias
  last_name: Hunstig
citation:
  ama: 'Schemmel R, Althoff S, Sextro W, Unger A, Brökelmann M, Hunstig M. Effects
    of different working frequencies on the joint formation in copper wire bonding.
    In: <i>CIPS 2018 - 10th International Conference on Integrated Power Electronics
    Systems (CIPS 2018)</i>. Stuttgart, Germany; 2018:230-235.'
  apa: Schemmel, R., Althoff, S., Sextro, W., Unger, A., Brökelmann, M., &#38; Hunstig,
    M. (2018). Effects of different working frequencies on the joint formation in
    copper wire bonding. In <i>CIPS 2018 - 10th International Conference on Integrated
    Power Electronics Systems (CIPS 2018)</i> (pp. 230–235). Stuttgart, Germany.
  bibtex: '@inproceedings{Schemmel_Althoff_Sextro_Unger_Brökelmann_Hunstig_2018, place={Stuttgart,
    Germany}, title={Effects of different working frequencies on the joint formation
    in copper wire bonding}, booktitle={CIPS 2018 - 10th International Conference
    on Integrated Power Electronics Systems (CIPS 2018)}, author={Schemmel, Reinhard
    and Althoff, Simon and Sextro, Walter and Unger, Andreas and Brökelmann, Michael
    and Hunstig, Matthias}, year={2018}, pages={230–235} }'
  chicago: Schemmel, Reinhard, Simon Althoff, Walter Sextro, Andreas Unger, Michael
    Brökelmann, and Matthias Hunstig. “Effects of Different Working Frequencies on
    the Joint Formation in Copper Wire Bonding.” In <i>CIPS 2018 - 10th International
    Conference on Integrated Power Electronics Systems (CIPS 2018)</i>, 230–35. Stuttgart,
    Germany, 2018.
  ieee: R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, and M. Hunstig,
    “Effects of different working frequencies on the joint formation in copper wire
    bonding,” in <i>CIPS 2018 - 10th International Conference on Integrated Power
    Electronics Systems (CIPS 2018)</i>, 2018, pp. 230–235.
  mla: Schemmel, Reinhard, et al. “Effects of Different Working Frequencies on the
    Joint Formation in Copper Wire Bonding.” <i>CIPS 2018 - 10th International Conference
    on Integrated Power Electronics Systems (CIPS 2018)</i>, 2018, pp. 230–35.
  short: 'R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig,
    in: CIPS 2018 - 10th International Conference on Integrated Power Electronics
    Systems (CIPS 2018), Stuttgart, Germany, 2018, pp. 230–235.'
date_created: 2019-05-27T10:24:37Z
date_updated: 2020-05-07T05:33:56Z
department:
- _id: '151'
language:
- iso: eng
page: 230-235
place: Stuttgart, Germany
project:
- _id: '93'
  grant_number: MP-1-1-015
  name: Hochleistungsbonden in energieeffizienten Leistungshalbleitermodulen
publication: CIPS 2018 - 10th International Conference on Integrated Power Electronics
  Systems (CIPS 2018)
quality_controlled: '1'
status: public
title: Effects of different working frequencies on the joint formation in copper wire
  bonding
type: conference
user_id: '210'
year: '2018'
...