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21 Publications
2020 | Conference Paper | LibreCat-ID: 17355
@inproceedings{Schemmel_Scheidemann_Hemsel_Kirsch_Sextro_2020, title={Experimental analysis and modelling of bond formation in ultrasonic heavy wire bonding}, booktitle={CIPS 2020; 11th International Conference on Integrated Power Electronics Systems}, author={Schemmel, Reinhard and Scheidemann, Claus and Hemsel, Tobias and Kirsch, Olaf and Sextro, Walter}, year={2020}, pages={1–6} }
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