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5 Publications
2019 | Journal Article | LibreCat-ID: 10334
Schemmel R, Hemsel T, Dymel C, Hunstig M, Brökelmann M, Sextro W. Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding. Sensors and Actuators A: Physical. 2019;295:653-662. doi:10.1016/j.sna.2019.04.025
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| DOI
2018 | Conference Paper | LibreCat-ID: 9992
Dymel C, Eichwald P, Schemmel R, et al. Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process. In: (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany). ; 2018:1-6.
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2018 | Conference Paper | LibreCat-ID: 9993
Dymel C, Schemmel R, Hemsel T, Sextro W, Brökelmann M, Hunstig M. Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding. In: (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan). ; 2018:41-44.
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2018 | Conference Paper | LibreCat-ID: 9997
Schemmel R, Althoff S, Sextro W, Unger A, Brökelmann M, Hunstig M. Effects of different working frequencies on the joint formation in copper wire bonding. In: CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018). Stuttgart, Germany; 2018:230-235.
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2017 | Journal Article | LibreCat-ID: 9973
Eichwald P, Althoff S, Schemmel R, et al. Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design. IMAPSource. 2017;Vol. 2017, No. 1.
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