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5 Publications
2019 | Journal Article | LibreCat-ID: 10334
Schemmel, Reinhard, Tobias Hemsel, Collin Dymel, Matthias Hunstig, Michael Brökelmann, and Walter Sextro. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical 295 (2019): 653–62. https://doi.org/10.1016/j.sna.2019.04.025.
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| DOI
2018 | Conference Paper | LibreCat-ID: 9992
Dymel, Collin, Paul Eichwald, Reinhard Schemmel, Tobias Hemsel, Michael Brökelmann, Matthias Hunstig, and Walter Sextro. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” In (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 1–6, 2018.
LibreCat
2018 | Conference Paper | LibreCat-ID: 9993
Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 41–44, 2018.
LibreCat
2018 | Conference Paper | LibreCat-ID: 9997
Schemmel, Reinhard, Simon Althoff, Walter Sextro, Andreas Unger, Michael Brökelmann, and Matthias Hunstig. “Effects of Different Working Frequencies on the Joint Formation in Copper Wire Bonding.” In CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), 230–35. Stuttgart, Germany, 2018.
LibreCat
2017 | Journal Article | LibreCat-ID: 9973
Eichwald, Paul, Simon Althoff, Reinhard Schemmel, Walter Sextro, Andreas Unger, Michael Brökelmann, and Matthias Hunstig. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design.” IMAPSource Vol. 2017, No. 1 (2017).
LibreCat