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5 Publications
2019 | Journal Article | LibreCat-ID: 10334
R. Schemmel, T. Hemsel, C. Dymel, M. Hunstig, M. Brökelmann, and W. Sextro, “Using complex multi-dimensional vibration trajectories in ultrasonic bonding and welding,” Sensors and Actuators A: Physical, vol. 295, pp. 653–662, 2019, doi: 10.1016/j.sna.2019.04.025.
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| DOI
2018 | Conference Paper | LibreCat-ID: 9992
C. Dymel et al., “Numerical and statistical investigation of weld formation in a novel two-dimensional copper-copper bonding process,” in (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
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2018 | Conference Paper | LibreCat-ID: 9993
C. Dymel, R. Schemmel, T. Hemsel, W. Sextro, M. Brökelmann, and M. Hunstig, “Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding,” in (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
LibreCat
2018 | Conference Paper | LibreCat-ID: 9997
R. Schemmel, S. Althoff, W. Sextro, A. Unger, M. Brökelmann, and M. Hunstig, “Effects of different working frequencies on the joint formation in copper wire bonding,” in CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), 2018, pp. 230–235.
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2017 | Journal Article | LibreCat-ID: 9973
P. Eichwald et al., “Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design,” IMAPSource, vol. Vol. 2017, No. 1, 2017.
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