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5 Publications
2019 | Journal Article | LibreCat-ID: 10334
Schemmel, Reinhard, et al. “Using Complex Multi-Dimensional Vibration Trajectories in Ultrasonic Bonding and Welding.” Sensors and Actuators A: Physical, vol. 295, 2019, pp. 653–62, doi:10.1016/j.sna.2019.04.025.
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| DOI
2018 | Conference Paper | LibreCat-ID: 9992
Dymel, Collin, et al. “Numerical and Statistical Investigation of Weld Formation in a Novel Two-Dimensional Copper-Copper Bonding Process.” (Proceedings of 7th Electronics System-Integration Technology Conference, Dresden, Germany), 2018, pp. 1–6.
LibreCat
2018 | Conference Paper | LibreCat-ID: 9993
Dymel, Collin, et al. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 2018, pp. 41–44.
LibreCat
2018 | Conference Paper | LibreCat-ID: 9997
Schemmel, Reinhard, et al. “Effects of Different Working Frequencies on the Joint Formation in Copper Wire Bonding.” CIPS 2018 - 10th International Conference on Integrated Power Electronics Systems (CIPS 2018), 2018, pp. 230–35.
LibreCat
2017 | Journal Article | LibreCat-ID: 9973
Eichwald, Paul, et al. “Multi-Dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design.” IMAPSource, vol. Vol. 2017, No. 1, 2017.
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