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13 Publications
2017 | Journal Article | LibreCat-ID: 9973
Multi-dimensional Ultrasonic Copper Bonding – New Challenges for Tool Design
P. Eichwald, S. Althoff, R. Schemmel, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, IMAPSource Vol. 2017, No. 1 (2017).
LibreCat
P. Eichwald, S. Althoff, R. Schemmel, W. Sextro, A. Unger, M. Brökelmann, M. Hunstig, IMAPSource Vol. 2017, No. 1 (2017).
2017 | Conference Paper | LibreCat-ID: 9982
MoRFUS: Mobile Reinigungseinheit für Förderketten basierend auf Ultraschall
R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik, Kiel 2017, 2017, pp. 611–614.
LibreCat
R. Schemmel, T. Hemsel, W. Sextro, in: 43. Deutsche Jahrestagung Für Akustik, Kiel 2017, 2017, pp. 611–614.
2016 | Conference Paper | LibreCat-ID: 9968
Validated Simulation of the Ultrasonic Wire Bonding Process
A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.
LibreCat
A. Unger, R. Schemmel, T. Meyer, F. Eacock, P. Eichwald, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016, IEEE CPMT Symposium Japan, 2016, pp. 251–254.