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1 Publication
2020 | Conference Paper | LibreCat-ID: 17706
Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. In: 2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). ; 2020. doi:10.1109/eurosime48426.2020.9152679
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