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1 Publication
2019 | Conference Paper | LibreCat-ID: 15412
Impact of multi-dimensional vibration trajectories on quality and failure modes in ultrasonic bonding
R. Schemmel, F. Eacock, C. Dymel, T. Hemsel, M. Hunstig, M. Brökelmann, W. Sextro, in: International Symposium on Microelectronics, 2019, pp. 509–514.
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R. Schemmel, F. Eacock, C. Dymel, T. Hemsel, M. Hunstig, M. Brökelmann, W. Sextro, in: International Symposium on Microelectronics, 2019, pp. 509–514.