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17 Publications


2023 | Dissertation | LibreCat-ID: 41971
Predicting the Bond Quality of Heavy Copper Wire Bonds using a Friction Model Approach
S. Althoff, Predicting the Bond Quality of Heavy Copper Wire Bonds Using a Friction Model Approach, Shaker, 2023.
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2023 | Conference Paper | LibreCat-ID: 44036
Analysis of temperature effect on strength and microstructure in friction induced recycling process (FIRP)
T. Borgert, W. Homberg, in: Materials Research Proceedings, Materials Research Forum LLC, 2023.
LibreCat | DOI
 

2023 | Conference Paper | LibreCat-ID: 43044
Proof of concept for incremental sheet metal forming by means of electromagnetic and electrohydraulic high-speed forming
M. Holzmüller, M. Linnemann, W. Homberg, V. Psyk, V. Kräusel, J. Kroos, in: Materials Research Proceedings, Materials Research Forum LLC, 2023, pp. 11–18.
LibreCat | DOI
 

2021 | Journal Article | LibreCat-ID: 24589
Assessment of AlZnMgCu alloy powder modification for crack-free laser powder bed fusion by differential fast scanning calorimetry
E. Zhuravlev, B. Milkereit, B. Yang, S. Heiland, P. Vieth, M. Voigt, M. Schaper, G. Grundmeier, C. Schick, O. Kessler, Materials & Design (2021).
LibreCat | DOI
 

2021 | Dissertation | LibreCat-ID: 37579
Festigkeitssteigerung von Aluminiumblechformteilen der 5000-Serie durch Erweiterung der Formgebungsgrenzen stark kaltverfestigter Ausgangswerkstoffe
A.A. Camberg, Festigkeitssteigerung von Aluminiumblechformteilen der 5000-Serie durch Erweiterung der Formgebungsgrenzen stark kaltverfestigter Ausgangswerkstoffe, Shaker Verlag, 2021.
LibreCat | DOI
 

2021 | Journal Article | LibreCat-ID: 21436
Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
R. Schemmel, V. Krieger, T. Hemsel, W. Sextro, Microelectronics Reliability 119 (2021) 114077.
LibreCat | DOI
 

2020 | Journal Article | LibreCat-ID: 19973
Improvement of a rivet geometry for the self-piercing riveting of high-strength steel and multi-material joints
B. Uhe, C.-M. Kuball, M. Merklein, G. Meschut, Production Engineering 14 (2020) 417–423.
LibreCat | DOI
 

2018 | Conference Paper | LibreCat-ID: 9999
Intelligent Production of Wire Bonds using Multi-Objective Optimization – Insights, Opportunities and Challenges
A. Unger, M. Hunstig, T. Meyer, M. Brökelmann, W. Sextro, in: In Proceedings of IMAPS 2018 – 51st Symposium on Microelectronics, Pasadena, CA, 2018, 2018.
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2018 | Journal Article | LibreCat-ID: 13186
Next Generation of Guanidine Quinoline Copper Complexes for Highly Controlled ATRP: Influence of Backbone Substitution on Redox Chemistry and Solubility
T. Rösener, A. Hoffmann, S. Herres-Pawlis, European Journal of Inorganic Chemistry 2018 (2018) 3164–3175.
LibreCat | DOI
 

2017 | Journal Article | LibreCat-ID: 13187
Detection of Copper Bisguanidine NO Adducts by UV-vis Spectroscopy and a SuperFocus Mixer
A. Oppermann, L. Laurini, F. Etscheidt, K. Hollmann, F. Strassl, A. Hoffmann, D. Schurr, R. Dittmeyer, G. Rinke, S. Herres-Pawlis, Chemical Engineering \& Technology 40 (2017) 1475–1483.
LibreCat | DOI
 

2016 | Conference Paper | LibreCat-ID: 9959
Effect of different oxide layers on the ultrasonic copper wire bond process
F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M. Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.
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2016 | Conference Paper | LibreCat-ID: 9966
Reliable Manufacturing of Heavy Copper Wire Bonds Using Online Parameter Adaptation
T. Meyer , A. Unger, S. Althoff, W. Sextro, M. Brökelmann, M. Hunstig, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 622–628.
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2014 | Conference Paper | LibreCat-ID: 9868
Improving the bond quality of copper wire bonds using a friction model approach
S. Althoff, J. Neuhaus, T. Hemsel, W. Sextro, in: Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, 2014, pp. 1549–1555.
LibreCat | DOI
 

2014 | Conference Paper | LibreCat-ID: 9870
Microstructural investigations of aluminum and copper wire bonds
F. Eacock , M. Schaper, S. Althoff, A. Unger, P. Eichwald, F. Hengsbach, C. Zinn, Martin Joachim Holzweissig, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014.
LibreCat | DOI
 

2014 | Conference Paper | LibreCat-ID: 9871
Analysis Method of Tool Topography Change and Identification of Wear Indicators for Heavy Copper Wire Wedge Bonding
P. Eichwald, W. Sextro, S. Althof, F. Eacock, A. Unger, T. Meyer, K. Guth, in: Proceedings of the 47th International Symposium on Microelectronics, 2014, pp. 856–861.
LibreCat | DOI
 

2014 | Conference Paper | LibreCat-ID: 9895
Experimental and Numerical Simulation Study of Pre-Deformed Heavy Copper Wire Wedge Bonds
A. Unger, W. Sextro, S. Althoff, P. Eichwald, T. Meyer, F. Eacock, M. Brökelmann, in: Proceedings of the 47th International Symposium on Microelectronics (IMAPS), San Diego, CA, US, 2014, pp. 289–294.
LibreCat
 

2010 | Journal Article | LibreCat-ID: 4548
Oxygen sensing by fluorescence quenching of [Cu(btmgp)I]
S. Herres-Pawlis, G. Berth, V. Wiedemeier, L. Schmidt, A. Zrenner, H.-J. Warnecke, Journal of Luminescence 130 (2010) 1958–1962.
LibreCat | DOI
 

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