Please note that LibreCat no longer supports Internet Explorer versions 8 or 9 (or earlier).

We recommend upgrading to the latest Internet Explorer, Google Chrome, or Firefox.

1 Publication


2016 | Conference Paper | LibreCat-ID: 9959
Effect of different oxide layers on the ultrasonic copper wire bond process
F. Eacock, A. Unger, P. Eichwald, O. Grydin, F. Hengsbach, S. Althoff, M. Schaper, K. Guth, in: IEEE 66th Electronic Components and Technology Conference, 2016, pp. 2111–2118.
LibreCat | DOI
 

Filters and Search Terms

keyword="Ultrasonic copper wire bonding"

Search

Filter Publications

Display / Sort

Export / Embed