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1 Publication
2021 | Journal Article | LibreCat-ID: 21436
Schemmel, Reinhard, Viktor Krieger, Tobias Hemsel, and Walter Sextro. “Co-Simulation of MATLAB and ANSYS for Ultrasonic Wire Bonding Process Optimization.” Microelectronics Reliability 119 (2021): 114077. https://doi.org/10.1016/j.microrel.2021.114077.
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