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2 Publications
2021 | Journal Article | LibreCat-ID: 21436
Schemmel R, Krieger V, Hemsel T, Sextro W. Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization. Microelectronics Reliability. 2021;119:114077. doi:https://doi.org/10.1016/j.microrel.2021.114077
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| DOI
2010 | Conference Paper | LibreCat-ID: 23858
Kretzschmar N, Schöppner V. Simulating Tightly Intermeshing, Co-Rotating Twin Screw Extruders with SIGMA. In: Proceedings of the 2010 Summer Computer Simulation Conference. SCSC ’10. San Diego, CA, USA: Society for Computer Simulation International; 2010:133–140.
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