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1 Publication
2018 | Conference Paper | LibreCat-ID: 9993
Dymel, Collin, Reinhard Schemmel, Tobias Hemsel, Walter Sextro, Michael Brökelmann, and Matthias Hunstig. “Experimental Investigations on the Impact of Bond Process Parameters in Two-Dimensional Ultrasonic Copper Bonding.” In (Proceedings of 8th Electronics IEEE CPMT Symposium Japan (ICSJ 2018), Kyoto, Japan), 41–44, 2018.
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