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1 Publication
2016 | Conference Paper | LibreCat-ID: 9968
Unger A, Schemmel R, Meyer T, et al. Validated Simulation of the Ultrasonic Wire Bonding Process. In: Wear Modeling in Copper Wire Wedge Bonding. IEEE CPMT Symposium Japan, 2016. IEEE CPMT Symposium Japan; 2016:251-254.
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