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1 Publication
2013 | Conference Paper | LibreCat-ID: 9797
Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. “A Friction Based Approach for Modeling Wire Bonding.” In IMAPS 2013, 46th International Symposium on Microelectronics. Orlando (Florida), USA, 2013. https://doi.org/10.4071/isom-2013-TA67.
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