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6 Publications
2024 | Book Chapter | LibreCat-ID: 53624
@inbook{Neuhausen_Ahlers_2024, place={München}, title={Modellierungen außerinstitutioneller Aneignungsprozesse digital-materieller Interfaces und (musik-)pädagogische Anschlüsse}, booktitle={Musik – Digitalisierung – Bildung}, publisher={kopaed}, author={Neuhausen, Timo and Ahlers, Michael}, editor={Neuhaus, Daniela and Keden, Helmke Jan}, year={2024}, pages={77–96} }
LibreCat
2017 | Dissertation | LibreCat-ID: 9979
@book{Neuhaus_2017, title={Multiskalen-Kontaktmodellierung unter Berücksichtigung der Rauigkeit und fluiden Zwischenschichten am Beispiel des Rad-Schiene-Kontakts}, publisher={Shaker}, author={Neuhaus, Jan}, year={2017} }
LibreCat
2015 | Conference Paper | LibreCat-ID: 9952
@inproceedings{Schulte_Neuhaus_Sextro_2015, title={A Mechanical Model for the Dynamical Contact of Elastic Rough Bodies with Viscoelastic Properties}, booktitle={Proceedings of ICoEV 2015 International Conference on Engineering Vibration}, author={Schulte, Frank and Neuhaus, Jan and Sextro, Walter}, year={2015}, pages={1109–1117} }
LibreCat
2014 | Conference Paper | LibreCat-ID: 9868
@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2014, title={Improving the bond quality of copper wire bonds using a friction model approach}, DOI={10.1109/ECTC.2014.6897500}, booktitle={Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th}, author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2014}, pages={1549–1555} }
LibreCat
| DOI
2014 | Conference Paper | LibreCat-ID: 9887
@inproceedings{Neuhaus_Sextro_2014, title={Thermo-Mechanical Model for Wheel Rail Contact using Coupled Point Contact Elements}, booktitle={Proceedings of the 5th International Conference on Computational Methods}, publisher={ScienTech Publisher}, author={Neuhaus, Jan and Sextro, Walter}, editor={Liu, G.R. and Guan, Z.W.Editors}, year={2014} }
LibreCat
2013 | Conference Paper | LibreCat-ID: 9797
@inproceedings{Althoff_Neuhaus_Hemsel_Sextro_2013, place={Orlando (Florida), USA}, title={A friction based approach for modeling wire bonding}, DOI={10.4071/isom-2013-TA67}, booktitle={IMAPS 2013, 46th International Symposium on Microelectronics}, author={Althoff, Simon and Neuhaus, Jan and Hemsel, Tobias and Sextro, Walter}, year={2013} }
LibreCat
| DOI