4 Publications
2026 | Journal Article | LibreCat-ID: 66555 | 
M. Kim et al., “Engineering Disordered Many‐Particle Plasmonic Nanoclusters for Wafer‐Scale Uniform and Giant Electromagnetic Field Enhancement,” Laser & Photonics Reviews, Art. no. e71610, 2026, doi: 10.1002/lpor.71610.
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2026 | Journal Article | LibreCat-ID: 66632 |
V. Devaraj et al., “Spatially Uniform and Defect‐Tolerant Plasmonic Responses in 3D Printed Gold Nanoparticle Assemblies,” Laser & Photonics Reviews, Art. no. e71686, 2026, doi: 10.1002/lpor.71686.
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2025 | Conference Paper | LibreCat-ID: 61352
V. Devaraj et al., “Dynamic and Reversible Plasmonic Nanogaps From Isolated Dimer Nanoparticles via Self-Assembly,” 2025, doi: 10.1109/cleo/europe-eqec65582.2025.11109762.
LibreCat
| DOI
2025 | Journal Article | LibreCat-ID: 58642
V. Devaraj et al., “Self-assembly of isolated plasmonic dimers with sub-5 nm gaps on a metallic mirror,” Nanoscale Horizons, vol. 10, pp. 537–548, 2025, doi: 10.1039/d4nh00546e.
LibreCat
| DOI
4 Publications
2026 | Journal Article | LibreCat-ID: 66555 |
M. Kim et al., “Engineering Disordered Many‐Particle Plasmonic Nanoclusters for Wafer‐Scale Uniform and Giant Electromagnetic Field Enhancement,” Laser & Photonics Reviews, Art. no. e71610, 2026, doi: 10.1002/lpor.71610.
LibreCat
| DOI
| Download (ext.)
2026 | Journal Article | LibreCat-ID: 66632 |
V. Devaraj et al., “Spatially Uniform and Defect‐Tolerant Plasmonic Responses in 3D Printed Gold Nanoparticle Assemblies,” Laser & Photonics Reviews, Art. no. e71686, 2026, doi: 10.1002/lpor.71686.
LibreCat
| DOI
| Download (ext.)
2025 | Conference Paper | LibreCat-ID: 61352
V. Devaraj et al., “Dynamic and Reversible Plasmonic Nanogaps From Isolated Dimer Nanoparticles via Self-Assembly,” 2025, doi: 10.1109/cleo/europe-eqec65582.2025.11109762.
LibreCat
| DOI
2025 | Journal Article | LibreCat-ID: 58642
V. Devaraj et al., “Self-assembly of isolated plasmonic dimers with sub-5 nm gaps on a metallic mirror,” Nanoscale Horizons, vol. 10, pp. 537–548, 2025, doi: 10.1039/d4nh00546e.
LibreCat
| DOI