Innovation in Reconfigurable Computing Fabrics: from Devices to Architectures (guest editorial)

R. F. DeMara, M. Platzner, M. Ottavi, IEEE Transactions on Computers and IEEE Transactions on Emerging Topics in Computing (2017).

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Journal Article | English
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F. DeMara, Ronald; Platzner, MarcoLibreCat; Ottavi, Marco
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IEEE Transactions on Computers and IEEE Transactions on Emerging Topics in Computing
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F. DeMara R, Platzner M, Ottavi M. Innovation in Reconfigurable Computing Fabrics: from Devices to Architectures (guest editorial). IEEE Transactions on Computers and IEEE Transactions on Emerging Topics in Computing. 2017. doi:10.1109/TETC.2016.2641599
F. DeMara, R., Platzner, M., & Ottavi, M. (2017). Innovation in Reconfigurable Computing Fabrics: from Devices to Architectures (guest editorial). IEEE Transactions on Computers and IEEE Transactions on Emerging Topics in Computing. https://doi.org/10.1109/TETC.2016.2641599
@article{F. DeMara_Platzner_Ottavi_2017, title={Innovation in Reconfigurable Computing Fabrics: from Devices to Architectures (guest editorial)}, DOI={10.1109/TETC.2016.2641599}, journal={IEEE Transactions on Computers and IEEE Transactions on Emerging Topics in Computing}, author={F. DeMara, Ronald and Platzner, Marco and Ottavi, Marco}, year={2017} }
F. DeMara, Ronald, Marco Platzner, and Marco Ottavi. “Innovation in Reconfigurable Computing Fabrics: From Devices to Architectures (Guest Editorial).” IEEE Transactions on Computers and IEEE Transactions on Emerging Topics in Computing, 2017. https://doi.org/10.1109/TETC.2016.2641599.
R. F. DeMara, M. Platzner, and M. Ottavi, “Innovation in Reconfigurable Computing Fabrics: from Devices to Architectures (guest editorial),” IEEE Transactions on Computers and IEEE Transactions on Emerging Topics in Computing, 2017.
F. DeMara, Ronald, et al. “Innovation in Reconfigurable Computing Fabrics: From Devices to Architectures (Guest Editorial).” IEEE Transactions on Computers and IEEE Transactions on Emerging Topics in Computing, 2017, doi:10.1109/TETC.2016.2641599.

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