Numerical Simulation of Forced Convection in a Microchannel with Realistic Roughness of 3D Printed Surface

S.A. Manavi, E. Kenig, in: Computer Aided Chemical Engineering, 29th European Symposium on Computer Aided Process Engineering, Eindhoven, Netherlands, 2019.

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Manavi SA, Kenig E. Numerical Simulation of Forced Convection in a Microchannel with Realistic Roughness of 3D Printed Surface. In: Computer Aided Chemical Engineering. Eindhoven, Netherlands: 29th European Symposium on Computer Aided Process Engineering; 2019. doi:10.1016/b978-0-12-818634-3.50138-7
Manavi, S. A., & Kenig, E. (2019). Numerical Simulation of Forced Convection in a Microchannel with Realistic Roughness of 3D Printed Surface. In Computer Aided Chemical Engineering. Eindhoven, Netherlands: 29th European Symposium on Computer Aided Process Engineering. https://doi.org/10.1016/b978-0-12-818634-3.50138-7
@inproceedings{Manavi_Kenig_2019, place={Eindhoven, Netherlands}, title={Numerical Simulation of Forced Convection in a Microchannel with Realistic Roughness of 3D Printed Surface}, DOI={10.1016/b978-0-12-818634-3.50138-7}, booktitle={Computer Aided Chemical Engineering}, publisher={29th European Symposium on Computer Aided Process Engineering}, author={Manavi, Seyed Alborz and Kenig, Eugeny}, year={2019} }
Manavi, Seyed Alborz, and Eugeny Kenig. “Numerical Simulation of Forced Convection in a Microchannel with Realistic Roughness of 3D Printed Surface.” In Computer Aided Chemical Engineering. Eindhoven, Netherlands: 29th European Symposium on Computer Aided Process Engineering, 2019. https://doi.org/10.1016/b978-0-12-818634-3.50138-7.
S. A. Manavi and E. Kenig, “Numerical Simulation of Forced Convection in a Microchannel with Realistic Roughness of 3D Printed Surface,” in Computer Aided Chemical Engineering, 2019.
Manavi, Seyed Alborz, and Eugeny Kenig. “Numerical Simulation of Forced Convection in a Microchannel with Realistic Roughness of 3D Printed Surface.” Computer Aided Chemical Engineering, 29th European Symposium on Computer Aided Process Engineering, 2019, doi:10.1016/b978-0-12-818634-3.50138-7.

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