Novel Field-Programmable Gate Array Architecture for Computing the Eigenvalue Decomposition of Para-Hermitian Polynomial Matrices
S. Kasap, S. Redif, IEEE Trans. on Very Large Scale Integration (VLSI) Systems 22 (2013) 522–536.
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Journal Article
Author
Kasap, Server;
Redif, Soydan
Publishing Year
Journal Title
IEEE Trans. on Very Large Scale Integration (VLSI) Systems
Volume
22
Issue
3
Page
522-536
LibreCat-ID
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Kasap S, Redif S. Novel Field-Programmable Gate Array Architecture for Computing the Eigenvalue Decomposition of Para-Hermitian Polynomial Matrices. IEEE Trans on Very Large Scale Integration (VLSI) Systems. 2013;22(3):522-536. doi:10.1109/TVLSI.2013.2248069
Kasap, S., & Redif, S. (2013). Novel Field-Programmable Gate Array Architecture for Computing the Eigenvalue Decomposition of Para-Hermitian Polynomial Matrices. IEEE Trans. on Very Large Scale Integration (VLSI) Systems, 22(3), 522–536. https://doi.org/10.1109/TVLSI.2013.2248069
@article{Kasap_Redif_2013, title={Novel Field-Programmable Gate Array Architecture for Computing the Eigenvalue Decomposition of Para-Hermitian Polynomial Matrices}, volume={22}, DOI={10.1109/TVLSI.2013.2248069}, number={3}, journal={IEEE Trans. on Very Large Scale Integration (VLSI) Systems}, publisher={IEEE}, author={Kasap, Server and Redif, Soydan}, year={2013}, pages={522–536} }
Kasap, Server, and Soydan Redif. “Novel Field-Programmable Gate Array Architecture for Computing the Eigenvalue Decomposition of Para-Hermitian Polynomial Matrices.” IEEE Trans. on Very Large Scale Integration (VLSI) Systems 22, no. 3 (2013): 522–36. https://doi.org/10.1109/TVLSI.2013.2248069.
S. Kasap and S. Redif, “Novel Field-Programmable Gate Array Architecture for Computing the Eigenvalue Decomposition of Para-Hermitian Polynomial Matrices,” IEEE Trans. on Very Large Scale Integration (VLSI) Systems, vol. 22, no. 3, pp. 522–536, 2013.
Kasap, Server, and Soydan Redif. “Novel Field-Programmable Gate Array Architecture for Computing the Eigenvalue Decomposition of Para-Hermitian Polynomial Matrices.” IEEE Trans. on Very Large Scale Integration (VLSI) Systems, vol. 22, no. 3, IEEE, 2013, pp. 522–36, doi:10.1109/TVLSI.2013.2248069.
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