Increasing the thermal conductivity of bonded joints
O. Hahn, G. Meschut, in: Tagungsband Zur EURADH’ 96, 1996, pp. 727–732.
Download
No fulltext has been uploaded.
Conference Paper
| English
Author
Hahn, O.;
Meschut, GersonLibreCat 
Department
Publishing Year
Proceedings Title
Tagungsband zur EURADH’ 96
Volume
2
Page
727-732
Conference
EURADH’ 96
Conference Location
Cambridge (UK)
Conference Date
1996-09-03 – 1996-09-06
LibreCat-ID
Cite this
Hahn O, Meschut G. Increasing the thermal conductivity of bonded joints. In: Tagungsband Zur EURADH’ 96. Vol 2. ; 1996:727-732.
Hahn, O., & Meschut, G. (1996). Increasing the thermal conductivity of bonded joints. In Tagungsband zur EURADH’ 96 (Vol. 2, pp. 727–732). Cambridge (UK).
@inproceedings{Hahn_Meschut_1996, title={Increasing the thermal conductivity of bonded joints}, volume={2}, booktitle={Tagungsband zur EURADH’ 96}, author={Hahn, O. and Meschut, Gerson}, year={1996}, pages={727–732} }
Hahn, O., and Gerson Meschut. “Increasing the Thermal Conductivity of Bonded Joints.” In Tagungsband Zur EURADH’ 96, 2:727–32, 1996.
O. Hahn and G. Meschut, “Increasing the thermal conductivity of bonded joints,” in Tagungsband zur EURADH’ 96, Cambridge (UK), 1996, vol. 2, pp. 727–732.
Hahn, O., and Gerson Meschut. “Increasing the Thermal Conductivity of Bonded Joints.” Tagungsband Zur EURADH’ 96, vol. 2, 1996, pp. 727–32.
Google Scholar