Joining with electrochemical support (ECUF): Cold pressure welding of copper

C. Ebbert, H.C. Schmidt, D. Rodman, F. Nuernberger, W. Homberg, H.J. Maier, G. Grundmeier, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY 214 (2014) 2179–2187.

Download
No fulltext has been uploaded.
Journal Article | Published | English
Author
; ; ; ; ; ;
Abstract
Joining metals using electrochemical support (ECUF) is a new process for cold pressure welding sheets and parts. This new process is based on an electrochemical in-line surface treatment followed by incremental pilger rolling. The ECUF process intends to cold pressure weld materials under optimized conditions. Oxide layers on metal surfaces are known to inhibit the formation of cold pressure welds. The in-line electrochemical treatment will be used to remove these surface oxides for specific engineering metals and alloys. Hence, an improved pressure weld formation at lower forces and smaller reduction ratios is expected for the electrochemically treated surfaces. Using a more flexible pressure welding process, the number of applications could be greatly improved. First tests with copper were performed to analyse the efficiency of the proposed electrochemical surface treatments. Two electrochemical treatments, the cathodic oxide-reduction and cyclovoltammetric oxide-reduction, were compared with conventional treatments (degreasing and scratch brushing) regarding their influence on the cold pressure welding process of copper. The weld strength of lap welds has been investigated as well as the necessary reduction threshold to form a weld. It was found that the electrochemical oxide reduction resulted in higher weld strength. The results of scanning electron microscopy (SEM) and energy dispersive analysis of X-rays (EDX) indicate that surface oxides were successfully removed by the electrochemical surface treatments. (C) 2014 Elsevier B.V. All rights reserved.
Publishing Year
Journal Title
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
Volume
214
Issue
10
Page
2179-2187
ISSN
LibreCat-ID

Cite this

Ebbert C, Schmidt HC, Rodman D, et al. Joining with electrochemical support (ECUF): Cold pressure welding of copper. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY. 2014;214(10):2179-2187. doi:10.1016/j.jmatprotec.2014.04.015
Ebbert, C., Schmidt, H. C., Rodman, D., Nuernberger, F., Homberg, W., Maier, H. J., & Grundmeier, G. (2014). Joining with electrochemical support (ECUF): Cold pressure welding of copper. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 214(10), 2179–2187. https://doi.org/10.1016/j.jmatprotec.2014.04.015
@article{Ebbert_Schmidt_Rodman_Nuernberger_Homberg_Maier_Grundmeier_2014, title={Joining with electrochemical support (ECUF): Cold pressure welding of copper}, volume={214}, DOI={10.1016/j.jmatprotec.2014.04.015}, number={10}, journal={JOURNAL OF MATERIALS PROCESSING TECHNOLOGY}, author={Ebbert, Christoph and Schmidt, H. C. and Rodman, D. and Nuernberger, F. and Homberg, W. and Maier, H. J. and Grundmeier, Guido}, year={2014}, pages={2179–2187} }
Ebbert, Christoph, H. C. Schmidt, D. Rodman, F. Nuernberger, W. Homberg, H. J. Maier, and Guido Grundmeier. “Joining with Electrochemical Support (ECUF): Cold Pressure Welding of Copper.” JOURNAL OF MATERIALS PROCESSING TECHNOLOGY 214, no. 10 (2014): 2179–87. https://doi.org/10.1016/j.jmatprotec.2014.04.015.
C. Ebbert et al., “Joining with electrochemical support (ECUF): Cold pressure welding of copper,” JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, vol. 214, no. 10, pp. 2179–2187, 2014.
Ebbert, Christoph, et al. “Joining with Electrochemical Support (ECUF): Cold Pressure Welding of Copper.” JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, vol. 214, no. 10, 2014, pp. 2179–87, doi:10.1016/j.jmatprotec.2014.04.015.

Export

Marked Publications

Open Data LibreCat

Web of Science

View record in Web of Science®

Search this title in

Google Scholar